MT40A1G16TD-062E AAT:F TR

Memory IC Overview

The MT40A1G16TD-062E AAT:F TR is a Micron DDR4 SDRAM component with a 16 Gbit storage capacity and 1 G x 16 organization. It operates at a clock frequency of 1.6 GHz with an access time of 19 ns and write cycle time of 15 ns. The supply voltage ranges from 1.14V to 1.26V, and it supports a temperature range of -40°C to 95°C (TC). This automotive-grade device features a POD interface and is housed in an FBGA package.

Memory IC Feature Summary

• Supports AEC-Q100 qualification for automotive reliability standards
• Includes programmable data strobe preamble and training capabilities
• Features on-die VREFDQ generation and multiple power-saving modes

Memory IC Applications

• Automotive infotainment systems
• Advanced driver-assistance systems (ADAS)
• In-vehicle networking controllers

Memory IC Procurement Notes

Verify the specific suffix 'AAT:F' against official Micron documentation to confirm its exact functional implications, as ordering suffixes may denote specific packaging or testing variations. Ensure the component meets current RoHS3 compliance requirements for your manufacturing process. Confirm availability status directly with authorized distributors, as automotive-grade components often have distinct supply chain channels compared to commercial parts.

Memory IC Selection Notes

Select this part when designing for automotive environments requiring high-density memory within strict thermal constraints up to 95°C case temperature. The 1.6 GHz speed and 16 Gbit capacity support complex data processing tasks. Verify that the system design accommodates the specific POD interface requirements and that the 1.2V nominal voltage aligns with the target platform's power delivery network.

Memory IC Part Context

This component belongs to Micron's MT40AxGxx series of DDR4 SDRAM devices designed for high-performance applications. The 'A' designation indicates automotive grade certification, while the 'F' suffix typically relates to the specific package variant or version. As a 16Gb density part, it serves as a key building block for modern embedded systems demanding significant memory bandwidth and capacity in a compact form factor.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material.