Memory IC MT41K256M8HX-187E:D product image

MT41K256M8HX-187E:D

  • Description:IC DRAM 2GBIT PAR 78FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:cc8afccb2da3 Category: Brand:

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MT41K256M8HX-187E:D is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 2GBIT PAR 78FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT41K256M8HX-187E:D

  • Description:IC DRAM 2GBIT PAR 78FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:Parallel
  • Clock Frequency:533 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-TFBGA
  • Supplier Device Package:78-FBGA (9x11.5)
  • Access Time:13.125 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT41K256M8HX-187E:D

MT41K256M8HX-187E:D

Memory IC Overview

The Micron MT41K256M8HX-187E:D is a 2Gb DDR3L SDRAM with a 256 Meg x 8 organization and an 8-bit data bus. It operates at a maximum clock rate of 1066 MHz (DDR3-1066) with a cycle time of 1.875ns. The device uses a 78-ball FBGA package (9mm x 11.5mm, Rev. D). Supply voltage ranges from 1.283V to 1.45V, supporting backward compatibility to 1.5V. It features eight internal banks, programmable CAS latency, on-die termination, and differential bidirectional data strobes.

Memory IC Feature Summary

  • Supports low voltage operation at 1.35V while maintaining backward compatibility with standard 1.5V DDR3 systems.
  • Includes dynamic on-die termination for data, strobe, and mask signals to improve signal integrity.
  • Features differential bidirectional data strobes and differential clock inputs for high-speed data transfer.
  • Provides selectable burst chop or fixed burst length operations via the mode register set.

Memory IC Applications

  • Mobile computing platforms requiring low power consumption
  • Embedded systems with limited power budgets
  • Industrial control applications operating within specified temperature ranges

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required system timing parameters. Confirm that the 78-ball FBGA package dimensions align with the target PCB footprint. Ensure the supply voltage environment supports the 1.35V nominal requirement or utilizes the backward-compatible 1.5V mode correctly.

Memory IC Selection Notes

Select this component when a 2Gb density with an 8-bit interface is required in a compact 78-ball package. Consider the 1066 MHz speed bin if lower power consumption is prioritized over higher bandwidth. Verify thermal requirements against the 0°C to +95°C commercial operating range.

Memory IC Part Context

This part belongs to the Micron MT41K family of DDR3L SDRAMs. It shares architectural similarities with other densities in the series but differs in pin count and organization. The HX suffix indicates the specific die revision and package type used for this configuration.

Memory IC Replacement Considerations

Compatible substitutes include other Micron DDR3L parts with matching 2Gb density and 8-bit width, such as the MT41K256M8DA series, provided the package and speed grade are compatible.

MT41K256M8HX-187E:DMT41K256M8HX-187E:D

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