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MT44K32M18RB-125E:A is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 576MBIT PARALLEL 168BGA. Review the specifications below when checking this part for your BOM.
The Micron MT44K32M18RB-125E:A is a 576Mb RLDRAM 3 component with a 32 Meg x 18 organization and 16 banks. It operates at a clock frequency of 800 MHz (tCK = 1.25ns) with a minimum cycle time (tRC) of 8ns, supporting a peak bandwidth of 76.8 Gb/s. The device utilizes a 168-ball Pb-free FBGA package and features 1.2V center-terminated push/pull I/O. It supports extended operating ranges from 200 to 1066 MHz and includes integrated on-die termination.
Verify the specific speed bin and temperature grade against the official Micron catalog before procurement. Confirm that the -125E suffix aligns with the required 800 MHz clock frequency and 8ns tRC timing specifications. Ensure the 168-ball FBGA package matches the target PCB footprint design constraints.
Select this part when a 576Mb capacity with a 18-bit data width is required for memory-intensive applications. Consider the 16-bank architecture for improved concurrency compared to lower-density alternatives. Verify compatibility with system voltage requirements, specifically the 1.35V VDD and 1.2V VDDQ levels.
This component belongs to the Micron MT44K series of RLDRAM 3 devices. It shares architectural similarities with the MT44K16M36 variant but differs in organization and data bus width. Both variants utilize the same 168-ball FBGA package form factor within the broader RLDRAM 3 family.
Consult the official Micron product catalog for verified substitutes. Cross-reference speed bins and package types to ensure functional equivalence without redesigning the host board layout or electrical interface.
The minimum cycle time (tRC) for the -125E speed bin is 8ns.
Yes, the device supports both multiplexed and non-multiplexed addressing capabilities.
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