MT46H32M32LFJG-6 IT:A TR

Memory IC Overview

The MT46H32M32LFJG-6 IT:A TR is a Mobile LPDDR SDRAM device manufactured by Micron Technology. It features a 1Gb density organized as 32 Meg x 32 with four internal banks. The component operates within a supply voltage range of 1.70V to 1.95V for both Vdd and Vddq. It utilizes a 168-ball VFBGA package measuring 12mm by 12mm. The specific -6 suffix indicates a cycle time of 6ns at CL=3, supporting a maximum clock frequency of 166 MHz. The IT designation confirms an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Supports partial-array self refresh (PASR) and deep power-down (DPD) modes for optimized power management
• Includes an on-chip temperature sensor to automatically control self-refresh rates based on thermal conditions
• Features bidirectional data strobes (DQS) per byte with edge-aligned data for reads and center-aligned data for writes
• Provides selectable output drive strength and clock stop capability to enhance signal integrity and reduce power consumption

Memory IC Applications

• Mobile devices requiring low-power memory solutions
• TI OMAP-based system-on-chip implementations
• Industrial embedded systems operating in extreme temperatures
• Portable consumer electronics with strict power constraints

Memory IC Procurement Notes

Verify the exact ordering suffix against the manufacturer's current datasheet to ensure compatibility with your design requirements. Confirm that the 'TR' suffix matches your required tape-and-reel packaging specifications. Check for any recent product change notices or end-of-life announcements directly from Micron Technology before finalizing procurement plans.

Memory IC Selection Notes

Select this component when an industrial temperature rating (-40°C to +85°C) is mandatory for the application environment. Choose the -6 speed grade if the system clock is limited to 166 MHz or lower. Ensure the PCB layout supports the 168-ball VFBGA footprint and accounts for the specific ball assignment map provided in the datasheet for proper signal routing.

Memory IC Part Context

This part belongs to the Micron Mobile LPDDR family designed specifically for Package-on-Package (PoP) applications. It is engineered to integrate directly with processors like the TI OMAP series. The device represents a high-density memory solution optimized for mobile platforms where space and power efficiency are critical design constraints.

Memory IC Replacement Considerations

Compatible substitutes include other Micron Mobile LPDDR parts with matching 168-ball VFBGA packages and industrial temperature ratings. Verify that alternative components support the same 32-bit data width and 1Gb density. Ensure the replacement part has a compatible cycle time specification relative to the target system clock frequency.