MT46H64M32LFCX-5 IT:B

Memory IC Overview

The MT46H64M32LFCX-5 IT:B is a Mobile Low-Power DDR SDRAM IC with a total capacity of 2Gb, organized as 64 Meg x 32. It operates within a supply voltage range of 1.70V to 1.95V for both VDD and VDDQ. The component features a -5 speed grade, providing a clock rate of 200 MHz and an access time of 5.0ns at CL=3. It utilizes a 90-ball VFBGA package measuring 9mm by 13mm. The device supports an operating temperature range from -40°C to +105°C.

Memory IC Feature Summary

• Internal pipelined double data rate architecture enabling two data accesses per clock cycle
• Four internal banks allowing concurrent operation
• Bidirectional data strobe per byte of data for edge-aligned reads and center-aligned writes
• Supports auto refresh, self refresh, and deep power-down modes

Memory IC Applications

• Mobile handheld devices requiring low-power memory
• Wireless communication equipment
• Automotive infotainment systems
• Portable consumer electronics

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to confirm package dimensions and temperature ratings. Ensure compatibility with system voltage requirements of 1.70V to 1.95V. Check for design revision updates that may affect pinout or electrical characteristics before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 2Gb density with a 32-bit interface is required in a compact 90-ball VFBGA footprint. The -5 speed grade suits applications needing 200 MHz performance. Consider the automotive temperature rating if the environment exceeds standard commercial limits. Verify that the system supports LPDDR signaling standards and differential clock inputs.

Memory IC Part Context

This part belongs to Micron's 2Gb Mobile LPDDR family, which includes variants with different densities and organization options. The CX package code specifically denotes the 90-ball VFBGA form factor used for space-constrained designs. Other family members may offer reduced page sizes or stacked die configurations for higher density in similar footprints.

Memory IC Replacement Considerations

Direct replacements must match the 2Gb density, 32-bit width, and 90-ball VFBGA package. Verify that alternative parts support the same 1.8V supply and 200MHz clock speed. Cross-reference the pinout and command set to ensure functional compatibility without PCB redesign.