Memory IC MT46V32M16BN-6 IT:F product image

MT46V32M16BN-6 IT:F

  • Description:IC DRAM 512MBIT PAR 60FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:b10355f6c637 Category: Brand:

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MT46V32M16BN-6 IT:F is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 512MBIT PAR 60FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT46V32M16BN-6 IT:F

  • Description:IC DRAM 512MBIT PAR 60FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR
  • Memory Size:512Mbit
  • Memory Organization:32M x 16
  • Memory Interface:Parallel
  • Clock Frequency:167 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:2.3V ~ 2.7V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:60-TFBGA
  • Supplier Device Package:60-FBGA (10x12.5)
  • Access Time:700 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT46V32M16BN-6 IT:F

MT46V32M16BN-6 IT:F

Memory IC Overview

The Micron MT46V32M16BN-6 IT:F is a 512Mb DDR SDRAM configured as 8 Meg x 16 with four internal banks. It utilizes a 60-ball FBGA package and operates at a clock rate of 167 MHz (PC2700) with a CAS latency of 2.5. The device supports a cycle time of 6ns and functions within an industrial temperature range of -40°C to +85°C. Power supply requirements are 2.5V ±0.2V for standard operation, rising to 2.6V ±0.1V for the highest speed grade.

Memory IC Feature Summary

  • Features an internal pipelined double-data-rate architecture enabling two data accesses per clock cycle.
  • Includes a delay-locked loop to align data transitions with the differential clock inputs.
  • Supports concurrent operation across four internal banks to maximize effective bandwidth.
  • Provides bidirectional data strobes for source-synchronous data capture on both read and write operations.

Memory IC Applications

  • High-performance computing systems requiring fast memory access
  • Industrial embedded applications operating in extreme temperatures
  • Graphics and display controllers needing high bandwidth
  • Networking equipment utilizing DDR SDRAM interfaces

Memory IC Procurement Notes

Verify the specific ordering suffixes against official Micron documentation to confirm package type, speed grade, and temperature rating. Ensure compatibility with SSTL_2 I/O standards and check for end-of-life status before finalizing procurement plans.

Memory IC Selection Notes

Select this component when a 16-bit wide interface is required for 512Mb capacity. Confirm that the system design supports the necessary 2.5V power rails and differential clocking. Verify that the industrial temperature range meets the environmental constraints of the target application.

Memory IC Part Context

This part belongs to the Micron 512Mb DDR SDRAM family, which includes x4, x8, and x16 configurations. The BN suffix indicates a lead-free 60-ball FBGA package. The IT designation specifies the industrial temperature range, while F denotes the specific revision level for the x16 configuration.

Memory IC Replacement Considerations

Check for direct substitutes within the same Micron DDR family with matching speed grades and package dimensions. Verify pin compatibility and electrical specifications before considering alternative manufacturers or newer generations like LPDDR.

Memory IC FAQ

What is the maximum clock frequency for the -6 speed grade?

The -6 speed grade supports a maximum clock frequency of 167 MHz, corresponding to PC2700 performance.

Does this device support self-refresh mode?

Yes, the MT46V32M16BN-6 IT:F supports self-refresh mode, provided it is not an Automotive (AT) variant.

MT46V32M16BN-6 IT:FMT46V32M16BN-6 IT:F

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