MT46V64M16P-75:A TR

Memory IC Overview

The MT46V64M16P-75:A TR is a 1Gb DDR SDRAM configured as 16 Meg x 16 with four internal banks. It utilizes a 66-pin TSOP package and operates at a cycle time of 7.5ns (CL=2.5). The device supports differential clock inputs, bidirectional data strobes, and programmable burst lengths of 2, 4, or 8. It features auto refresh, self refresh, and power-down modes for power management.

Memory IC Feature Summary

• Internal pipelined double-data-rate architecture enabling two data accesses per clock cycle
• Four internal banks allowing concurrent operation to hide row precharge and activation times
• Bidirectional data strobe (DQS) transmitted and received with data for source-synchronous capture
• Data mask (DM) capability for masking write data

Memory IC Applications

• High-speed computer systems requiring large memory capacity
• Graphics-intensive applications utilizing high bandwidth
• Networking equipment needing fast data access
• Industrial control systems operating within commercial temperature ranges

Memory IC Procurement Notes

Verify the specific ordering suffix 'TR' indicates tape and reel packaging if required by assembly processes. Confirm that the '-75' speed grade matches the system's timing requirements for a 7.5ns cycle time. Ensure the 66-pin TSOP footprint aligns with the PCB design. Check for RoHS compliance status and lead-free markings on the component surface.

Memory IC Selection Notes

Select this part when a 1Gb density with a 16-bit interface is necessary. The -75 speed grade suits systems operating at lower clock frequencies compared to faster variants. Consider the 66-pin TSOP package for through-hole or specific surface-mount constraints. Verify compatibility with SSTL_2 I/O standards and ensure the controller supports the required CAS latency settings.

Memory IC Part Context

This component belongs to Micron's 1Gb DDR SDRAM family, which includes x4, x8, and x16 configurations. It shares architectural similarities with other parts in the series, such as the MT46V256M4 and MT46V128M8. The device is designed for general-purpose high-performance computing applications where cost-effective high-density memory is prioritized.

Memory IC Replacement Considerations

Direct replacements include other speed grades within the same package, such as MT46V64M16P-6T:A or MT46V64M16P-5B:A, provided timing constraints allow. Cross-package replacements require redesigning the PCB layout due to different pin counts and form factors.