MT47H128M8B7-37E L:A

Memory IC Overview

The MT47H128M8B7-37E L:A is a 1Gb DDR2 SDRAM organized as 16 Meg x 8 with 8 internal banks. It operates at VDD and VDDQ of +1.8V ±0.1V using JEDEC-standard 1.8V I/O compatible with SSTL_18. The component utilizes a 68-ball FBGA package (:D) and supports a cycle time of 3.75ns corresponding to CL=4 at DDR2-533 speeds. It features a 4n-bit prefetch architecture, differential data strobe options, and on-die termination.

Memory IC Feature Summary

• Supports concurrent operation across eight internal banks for improved throughput
• Includes a DLL to align DQ and DQS transitions with the clock signal
• Features adjustable data-output drive strength and selectable burst lengths
• Complies with RoHS standards and supports JEDEC clock jitter specifications

Memory IC Applications

• High-performance computing systems requiring dense memory configurations
• Graphics processing units utilizing high-bandwidth memory interfaces
• Network infrastructure equipment demanding reliable synchronous dynamic storage

Memory IC Procurement Notes

Verify the specific ordering suffixes against official Micron documentation to confirm package type, timing grade, and temperature range. Ensure compatibility with system voltage requirements and interface standards before integration. Confirm availability status through authorized distributors as product lifecycles may change.

Memory IC Selection Notes

Select this component when designing systems that require 1Gb density in an x8 configuration. Ensure the motherboard traces support the required DDR2-533 signaling rates and power delivery for 1.8V operation. Consider thermal management solutions suitable for the FBGA package dimensions during layout.

Memory IC Part Context

This part belongs to the Micron 1Gb DDR2 SDRAM family, which also includes x4 and x16 variants. The family shares common architectural features such as the 4n-bit prefetch and mode register programming capabilities. It represents a generation of memory designed to bridge performance gaps between legacy DDR and newer DDR3 technologies.

Memory IC Replacement Considerations

Direct substitutes include other Micron parts within the same 1Gb DDR2 family with matching speed grades and package types. Verify pinout compatibility and electrical characteristics before swapping with components from different manufacturers.