Memory IC MT47H256M8EB-25E XIT:C TR product image

MT47H256M8EB-25E XIT:C TR

  • Description:IC DRAM 2GBIT PARALLEL 60FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:a212b13e4b88 Category: Brand:

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MT47H256M8EB-25E XIT:C TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 2GBIT PARALLEL 60FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT47H256M8EB-25E XIT:C TR

  • Description:IC DRAM 2GBIT PARALLEL 60FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR2
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:Parallel
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:60-TFBGA
  • Supplier Device Package:60-FBGA (9x11.5)
  • Access Time:400 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT47H256M8EB-25E XIT:C TR

MT47H256M8EB-25E XIT:C TR

Memory IC Overview

The MT47H256M8EB-25E XIT:C TR is a Micron DDR2 SDRAM component with a 256Mb capacity and x8 organization. It operates at a maximum clock frequency of 400 MHz with a 400 ps access time. The device uses a 1.8V supply voltage (1.7V to 1.9V range) and supports an industrial temperature range of -40°C to +95°C. It features a 60-ball FBGA package, 8 internal banks, and on-die termination.

Memory IC Feature Summary

  • Supports high-speed parallel data transfer via DDR2 architecture
  • Includes eight internal banks for concurrent operation
  • Features on-die termination for signal integrity

Memory IC Applications

  • Industrial embedded systems requiring wide temperature tolerance
  • Portable consumer electronics utilizing low-voltage memory
  • Network infrastructure equipment

Memory IC Procurement Notes

Verify the exact suffix 'XIT:C' against official Micron documentation to confirm specific manufacturing lot or revision details. Ensure the ordering code matches the required industrial temperature grade and package variant. Confirm availability status directly with authorized distributors as lead times may vary.

Memory IC Selection Notes

Select this part for designs requiring 256Mb density in a compact 60-ball FBGA footprint. It is suitable for applications needing 400MHz performance with strict industrial thermal constraints. Compare against standard commercial grades if operating temperatures exceed -40°C to +95°C.

Memory IC Part Context

This component belongs to the Micron MT47H family of DDR2 SDRAMs. It shares architectural similarities with other parts in the series but is distinguished by its specific density, bus width, and industrial temperature rating. The 'TR' suffix indicates tape and reel packaging for automated assembly.

Memory IC Replacement Considerations

Check for direct substitutes within the MT47H series that match the 256Mb capacity and x8 configuration. Verify pin compatibility and electrical specifications before replacing.

MT47H256M8EB-25E XIT:C TRMT47H256M8EB-25E XIT:C TR

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