Memory IC MT47H32M16NF-25E:H product image

MT47H32M16NF-25E:H

$3.49
  • Description:IC DRAM 512MBIT PARALLEL 84FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Bulk

SKU:77358e5c257b Category: Brand:

  
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MT47H32M16NF-25E:H is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 512MBIT PARALLEL 84FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT47H32M16NF-25E:H

  • Description:IC DRAM 512MBIT PARALLEL 84FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Bulk
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR2
  • Memory Size:512Mbit
  • Memory Organization:32M x 16
  • Memory Interface:Parallel
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:84-TFBGA
  • Supplier Device Package:84-FBGA (8x12.5)
  • Access Time:400 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT47H32M16NF-25E:H

MT47H32M16NF-25E:H

Memory IC Overview

The MT47H32M16NF-25E:H is a Micron Technology DDR2 SDRAM component with a total storage capacity of 512 Mbit. It features a memory organization of 32 Meg x 16 bits and supports parallel interface operations at a maximum clock frequency of 400 MHz. The device operates within a supply voltage range of 1.7 V to 1.9 V and has an access time of 400 ps. It is housed in an 84-pin TFBGA package (dimensions 11 mm x 19 mm) and is rated for industrial operating temperatures ranging from -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via DDR2 SDRAM technology with a 16-bit data bus width.
  • Designed for robust performance across extended industrial temperature ranges.
  • Utilizes a compact surface-mount TFBGA package for efficient board space utilization.

Memory IC Applications

  • Industrial control systems requiring reliable volatile memory
  • Embedded computing platforms with strict thermal constraints
  • Telecommunications infrastructure equipment

Memory IC Procurement Notes

Verify the specific suffix 'H' against official Micron documentation to confirm exact pinout, marking, and environmental compliance details. Ensure compatibility with system power rails and thermal management requirements before integration. Confirm availability status as distribution channels may vary.

Memory IC Selection Notes

Select this part when a 512 Mbit density with a 16-bit interface is required for DDR2 applications. Consider the -40°C to +85°C rating for environments exceeding standard commercial limits. Evaluate the TFBGA-84 footprint against existing PCB layout constraints and assembly capabilities.

Memory IC Part Context

This component belongs to the Micron MT47H series of DDR2 SDRAM devices. The series offers various densities and organizational configurations to support diverse memory subsystem designs. The MT47H32M16NF variant specifically addresses needs for moderate-density, wide-bus memory solutions in professional and industrial sectors.

Memory IC Replacement Considerations

Cross-reference with other Micron DDR2 parts sharing the same density and interface width. Verify electrical and mechanical compatibility before substituting with components from other manufacturers.

Memory IC FAQ

What is the maximum operating speed of the MT47H32M16NF-25E:H?

The device supports a maximum clock frequency of 400 MHz, corresponding to DDR2-800 performance.

Does this component support industrial temperature ranges?

Yes, the MT47H32M16NF-25E:H is rated for operation from -40°C to +85°C.

MT47H32M16NF-25E:HMT47H32M16NF-25E:H
$3.49
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