Memory IC MT47H64M16BT-3:A TR product image

MT47H64M16BT-3:A TR

  • Description:IC DRAM 1GBIT PARALLEL 92FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:996d50c9126b Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

MT47H64M16BT-3:A TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 1GBIT PARALLEL 92FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT47H64M16BT-3:A TR

  • Description:IC DRAM 1GBIT PARALLEL 92FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR2
  • Memory Size:1Gbit
  • Memory Organization:64M x 16
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:92-TFBGA
  • Supplier Device Package:92-FBGA (11x19)
  • Access Time:450 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT47H64M16BT-3:A TR

MT47H64M16BT-3:A TR

Memory IC Overview

The Micron MT47H64M16BT-3:A TR is a 1 Gbit DDR2 SDRAM organized as 8 Meg x 16 with eight internal banks. It operates at a maximum clock frequency of 533 MHz (DDR2-533) with a cycle time of 3.75 ns at CAS latency 4. The device uses a 92-ball FBGA package and supports JEDEC-standard 1.8V I/O. Power supply requirements are VDD = +1.8V ±0.1V and VDDQ = +1.8V ±0.1V.

Memory IC Feature Summary

  • Supports differential data strobe (DQS, DQS#) for improved signal integrity
  • Features an on-die termination (ODT) mechanism to reduce reflections
  • Includes a DLL to align data transitions with the clock signal
  • Allows programmable CAS latency and posted additive latency

Memory IC Applications

  • High-performance computing systems requiring 1.8V memory interfaces
  • Embedded applications utilizing 92-ball FBGA surface-mount packaging
  • Industrial equipment operating within specified temperature ranges

Memory IC Procurement Notes

Verify the specific speed grade suffix against current Micron documentation to ensure compatibility with system timing requirements. Confirm that the 92-ball FBGA footprint matches the target PCB layout. Check for RoHS compliance status in the latest datasheet revision before finalizing procurement specifications.

Memory IC Selection Notes

Select this component when a 16-bit wide interface is required for 1 Gbit capacity. Ensure the design accommodates the 1.8V power domain and SSTL_18 signaling standards. Consider the 92-ball FBGA package dimensions during mechanical integration and thermal management planning.

Memory IC Part Context

This part belongs to the Micron MT47HxMx family of DDR2 SDRAMs. It shares architectural features with other densities in the series, such as the MT47H256M4 and MT47H128M8. The family utilizes a common 4n-bit prefetch architecture and supports similar command sets and initialization sequences across different configurations.

Memory IC Replacement Considerations

Consult official Micron substitution guides for verified alternatives. Cross-reference pinouts and electrical characteristics carefully when evaluating potential replacements from other manufacturers.

MT47H64M16BT-3:A TRMT47H64M16BT-3:A TR

Click on the inquiry