Memory IC MT47H64M16HW-3 IT:H product image

MT47H64M16HW-3 IT:H

  • Description:IC DRAM 1GBIT PARALLEL 84FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Bulk

SKU:61a86bee7eff Category: Brand:

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MT47H64M16HW-3 IT:H is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 1GBIT PARALLEL 84FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT47H64M16HW-3 IT:H

  • Description:IC DRAM 1GBIT PARALLEL 84FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Bulk
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR2
  • Memory Size:1Gbit
  • Memory Organization:64M x 16
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:84-TFBGA
  • Supplier Device Package:84-FBGA (8x12.5)
  • Access Time:450 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT47H64M16HW-3 IT:H

MT47H64M16HW-3 IT:H

Memory IC Overview

The MT47H64M16HW-3 IT:H is a Micron DDR2 SDRAM component with a 1 Gbit density and 16-bit data bus width. It utilizes an 84-pin TFBGA package and operates at a maximum clock frequency of 333 MHz. The device supports a 4n-bit prefetch architecture and features eight internal banks for concurrent operations. Electrical specifications include a supply voltage range of 1.7 V to 1.9 V and an industrial temperature operating range from 0°C to +85°C.

Memory IC Feature Summary

  • Supports differential data strobe (DQS, DQS#) and duplicate output strobe (RDQS) options for x8 configurations.
  • Features on-die termination (ODT) and adjustable data-output drive strength.
  • Includes a DLL to align DQ and DQS transitions with the clock signal.

Memory IC Applications

  • Industrial embedded systems requiring high-speed memory access
  • Consumer electronics utilizing DDR2 SDRAM interfaces
  • Networking equipment with standard JEDEC I/O requirements

Memory IC Procurement Notes

Verify the specific suffix 'IT:H' against official Micron documentation to confirm the exact temperature grade and packaging variant. Ensure compatibility with existing PCB layouts designed for the 84-pin TFBGA form factor. Confirm that the 1.8V ±0.1V power supply rails meet the strict electrical requirements for reliable operation within the specified industrial temperature range.

Memory IC Selection Notes

Select this component when a 1 Gbit capacity with a 16-bit interface is required for space-constrained designs. The industrial temperature rating makes it suitable for environments exceeding standard commercial limits. Consider the 333 MHz speed grade if higher bandwidth is not critical, as it offers a balance between performance and power consumption for general-purpose applications.

Memory IC Part Context

This part belongs to the Micron MT47H64M16 family of DDR2 SDRAM devices. The family includes variants with different speeds, temperatures, and packages. The MT47H64M16 series provides 1 Gbit density in various configurations, including x4, x8, and x16 options, catering to diverse memory subsystem needs across multiple industries.

Memory IC Replacement Considerations

Consult Micron's official substitution guide for verified alternatives. Cross-reference pinouts and electrical characteristics carefully before replacing components in existing designs.

MT47H64M16HW-3 IT:HMT47H64M16HW-3 IT:H

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