MT48H8M32LFB5-75:G TR

Memory IC Overview

The Micron MT48H8M32LFB5-75:G TR is a 256Mb Mobile SDRAM configured as 8 Meg x 32 with four internal banks. It operates at VDD/VDDQ of 1.70–1.95V and supports a clock rate of 133 MHz with an access time of 6ns. The device utilizes a 90-ball VFBGA package (8mm x 13mm) and features LVTTL-compatible I/O. Key specifications include programmable burst lengths, auto precharge, partial-array self refresh, and deep power-down modes.

Memory IC Feature Summary

• Fully synchronous interface with all signals registered on the positive edge of the system clock
• Internal pipelined architecture allowing column address changes every clock cycle for high-speed random access
• Four internal banks enabling concurrent operation to hide precharge cycles
• On-chip temperature sensor integrated to dynamically control the refresh rate

Memory IC Applications

• Mobile handheld devices requiring low-power memory solutions
• Portable consumer electronics utilizing mobile SDRAM architectures
• Embedded systems needing compact quad-bank DRAM configurations

Memory IC Procurement Notes

Verify the component matches the specific 90-ball VFBGA package dimensions and lead-free construction indicated by the suffix. Confirm the speed grade corresponds to the required 133 MHz operational frequency and 6ns access time. Ensure the ordering suffix aligns with the desired industrial or commercial temperature range and power consumption profile before finalizing acquisition.

Memory IC Selection Notes

Select this part when a 32-bit data bus width is required within a compact mobile form factor. The 90-ball VFBGA package offers a smaller footprint compared to larger BGA options while maintaining high-density storage. Consider the low voltage requirements and power-saving features like deep power-down for battery-operated applications where energy efficiency is critical.

Memory IC Part Context

This component belongs to the Micron 256Mb Mobile SDRAM family, designed specifically for space-constrained portable electronics. It shares architectural similarities with other variants in the series but differs in organization and package type. The 8 Meg x 32 configuration provides a balanced trade-off between bandwidth and density for mobile applications.

Memory IC Replacement Considerations

Consult official Micron documentation for verified cross-references. No direct substitute part numbers are confirmed in the provided source material.

Memory IC FAQ

How does the device manage power consumption during idle states?

The device supports multiple power-saving modes including Deep Power-Down (DPD), Auto Power-Down, and Self Refresh, which significantly reduce current draw when the memory is not actively accessed.

What is the function of the on-chip temperature sensor?

The on-chip temperature sensor monitors the internal temperature of the device to automatically adjust the refresh rate, ensuring data integrity while optimizing power usage under varying thermal conditions.