MT51J256M32HF-80:A TR

Memory IC Overview

The Micron MT51J256M32HF-80:A TR is an 8 Gbit SGRAM device belonging to the GDDR5 family. It features a 32-bit data bus width and is organized as 256 Meg x 32. The component operates within a supply voltage range of 1.31 V to 1.39 V for core power and 1.46 V to 1.55 V for I/O power. It supports a clock frequency of 2 GHz and functions across a temperature range of 0°C to 95°C. The memory is housed in a 170-pin TFBGA package measuring 12 mm by 14 mm.

Memory IC Feature Summary

• Supports high-bandwidth parallel interface architecture suitable for graphics applications
• Integrates on-die termination and differential clock inputs for signal integrity
• Features programmable burst lengths and CAS latencies for flexible control

Memory IC Applications

• Graphics processing units (GPUs)
• High-performance computing systems
• Professional visualization workstations

Memory IC Procurement Notes

Verify the specific suffix A against the official Micron datasheet to confirm voltage and timing parameters. Confirm the 170-TFBGA package dimensions match your PCB footprint requirements. Check RoHS compliance status directly with the manufacturer or authorized distributor, as regulatory details may vary by production batch. Ensure the obsolete status does not impact long-term supply chain stability for your project.

Memory IC Selection Notes

Select this component when a 32-bit wide GDDR5 interface is required for high-throughput graphics rendering. Compare the 2 GHz speed grade against system clock constraints to ensure compatibility. Evaluate the thermal performance within the 0°C to 95°C operating range relative to your enclosure design. Consider the 170-pin form factor for space-constrained motherboard layouts compared to larger packages.

Memory IC Part Context

This part belongs to Micron's MT51J series of GDDR5 SGRAM devices. These components are engineered for demanding visual computing environments requiring substantial memory bandwidth. The series utilizes advanced process technologies to deliver high density within compact footprints, supporting modern display interfaces and parallel processing architectures.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing controller specifications before considering alternative vendors.