ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
MT52L256M64D2PP-107 WT:B TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 16GBIT 933MHZ 253VFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MT52L256M64D2PP-107 WT:B TR
- Description：IC DRAM 16GBIT 933MHZ 253VFBGA
- Series：-
- Mfr：Micron Technology Inc.
- Package：Tape & Reel (TR)
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - Mobile LPDDR3
- Memory Size：16Gbit
- Memory Organization：256M x 64
- Memory Interface：-
- Clock Frequency：933 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.2V
- Operating Temperature：-30°C ~ 85°C (TC)
- Mounting Type：Surface Mount
- Package / Case：253-VFBGA
- Supplier Device Package：253-VFBGA (11x11.5)
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MT52L256M64D2PP-107 WT:B TR
Memory IC Overview
The MT52L256M64D2PP-107 WT:B TR is a Mobile LPDDR3 SDRAM component manufactured by Micron Technology Inc. It features a total storage capacity of 16 Gbit, organized as 256 Meg x 64 bits. The device operates with a data bus width of 64 bits and utilizes a WFBGA-256 package configuration. This specific part number indicates the component is supplied in a tape and reel packaging format.
Memory IC Feature Summary
- Mobile LPDDR3 SDRAM technology for low-power applications
- High-density 16 Gbit storage capacity
- 64-bit data bus interface
Memory IC Applications
- Mobile computing devices
- Smartphones and tablets
- Embedded systems requiring high bandwidth
Memory IC Procurement Notes
Verify the exact suffix 'WT:B' against official Micron documentation to confirm wafer lot and testing specifications. Confirm that the 'TR' designation aligns with current manufacturing standards for tape and reel delivery. Ensure compatibility with system power requirements for LPDDR3 operation before procurement.
Memory IC Selection Notes
Select this component when a 16 Gbit density with a 64-bit interface is required for mobile form factors. Compare against similar MT52L series parts to ensure pinout and electrical characteristics match the target design. Verify package dimensions for PCB layout constraints.
Memory IC Part Context
This part belongs to the Micron MT52L series of Mobile LPDDR3 DRAMs. These components are designed for portable electronics where power efficiency and performance are critical. The series offers various densities and organization options to suit different application needs.
Memory IC Replacement Considerations
Consult Micron's official substitution guide for verified alternatives. Cross-reference pinouts and electrical specs with other MT52L variants. Do not assume compatibility with non-LPDDR3 memory types without rigorous validation.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
