Memory IC MT53B384M64D4EZ-062 WT:B TR product image

MT53B384M64D4EZ-062 WT:B TR

  • Description:IC DRAM 24GBIT 1.6GHZ FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:3e8365dba9ac Category: Brand:

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MT53B384M64D4EZ-062 WT:B TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 24GBIT 1.6GHZ FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT53B384M64D4EZ-062 WT:B TR

  • Description:IC DRAM 24GBIT 1.6GHZ FBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4
  • Memory Size:24Gbit
  • Memory Organization:384M x 64
  • Memory Interface:-
  • Clock Frequency:1.6 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.1V
  • Operating Temperature:-30°C ~ 85°C (TC)
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT53B384M64D4EZ-062 WT:B TR

MT53B384M64D4EZ-062 WT:B TR

Memory IC Overview

The Micron MT53B384M64D4EZ-062 is a mobile LPDDR4 SDRAM component with a total storage capacity of 24 Gbit. It features a data bus width of 64 bits and an organization of 384 M x 64. The device supports a maximum clock frequency of 1.6 GHz and operates at a maximum supply voltage of 1.1 V. It is housed in a POP-366 FBGA package and functions within a temperature range of -25°C to +85°C.

Memory IC Feature Summary

  • Mobile LPDDR4 architecture for high-bandwidth applications
  • Wide 64-bit data interface for efficient throughput
  • Compact FBGA packaging suitable for space-constrained designs

Memory IC Applications

  • Smartphones and mobile devices
  • Tablets and portable computing
  • Embedded systems requiring high memory density

Memory IC Procurement Notes

Verify the exact suffix and revision code against official Micron documentation before procurement, as minor variations can affect compatibility. Confirm current lifecycle status directly with the manufacturer or authorized distributors, as availability may be limited. Ensure that the specific package variant matches your PCB footprint requirements precisely.

Memory IC Selection Notes

Select this part when a 24 Gbit density with a 64-bit interface is required for mobile form factors. Consider the 1.6 GHz speed capability for bandwidth-intensive tasks. Evaluate the thermal operating range to ensure it meets the environmental constraints of the target application. Compare against other MT53B series options if different densities or pin counts are needed.

Memory IC Part Context

This component belongs to the Micron MT53B series of mobile LPDDR4 DRAMs. These parts are designed for next-generation mobile platforms, offering improved performance and power efficiency over previous generations. The series typically includes various densities and configurations to support diverse smartphone and tablet architectures.

Memory IC Replacement Considerations

Check for direct substitutes within the MT53B family with matching density and interface width. Verify pin-to-pin compatibility and electrical specifications before substitution. Consult Micron's official cross-reference guides for approved alternatives.

MT53B384M64D4EZ-062 WT:B TRMT53B384M64D4EZ-062 WT:B TR

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