Memory IC MT53B384M64D4NH-062 WT:B TR product image

MT53B384M64D4NH-062 WT:B TR

$37.40
  • Description:IC DRAM 24GBIT 1.6GHZ 272WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:14b7c2beb2b9 Category: Brand:

  
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MT53B384M64D4NH-062 WT:B TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 24GBIT 1.6GHZ 272WFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT53B384M64D4NH-062 WT:B TR

  • Description:IC DRAM 24GBIT 1.6GHZ 272WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4
  • Memory Size:24Gbit
  • Memory Organization:384M x 64
  • Memory Interface:-
  • Clock Frequency:1.6 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.1V
  • Operating Temperature:-30°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:272-WFBGA
  • Supplier Device Package:272-WFBGA (15x15)
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT53B384M64D4NH-062 WT:B TR

MT53B384M64D4NH-062 WT:B TR

Memory IC Overview

The MT53B384M64D4NH-062 WT:B TR is a Micron LPDDR4 dynamic random-access memory component. It features a storage capacity of 24 Gbit with an organization of 384 M x 64. The device supports a maximum clock frequency of 1.6 GHz and operates at a maximum supply voltage of 1.1 V. It utilizes a FBGA package configuration and is designed for surface mount technology (SMD/SMT) installation. The operational temperature range spans from -25°C to +85°C.

Memory IC Feature Summary

  • LPDDR4 mobile SDRAM architecture
  • High-density 24 Gbit storage configuration
  • FBGA package for compact integration

Memory IC Applications

  • Mobile computing platforms
  • Embedded systems requiring high bandwidth
  • Portable electronic devices

Memory IC Procurement Notes

Verify the exact part number suffix against official Micron documentation to confirm specific manufacturing lot codes and regional compliance markings. Confirm current lifecycle status directly with the manufacturer or authorized distributors, as availability may vary by region and production phase. Ensure compatibility with existing system power and thermal constraints before procurement.

Memory IC Selection Notes

Select this component when a 24 Gbit LPDDR4 solution with a 64-bit data bus width is required. The 1.6 GHz speed rating suits applications needing moderate-to-high memory throughput within standard mobile voltage limits. Verify that the FBGA footprint matches the target PCB design and that the operating temperature range meets the environmental specifications of the end product.

Memory IC Part Context

This part belongs to the Micron MT53B series of LPDDR4 DRAMs. These components are engineered for mobile and embedded applications where power efficiency and high density are critical. The series offers various configurations to support different bandwidth and capacity requirements in modern portable electronics.

Memory IC Replacement Considerations

Consult Micron's official cross-reference tools for verified substitutes. Ensure any replacement maintains identical pinout, voltage levels, and timing parameters to guarantee system compatibility.

MT53B384M64D4NH-062 WT:B TRMT53B384M64D4NH-062 WT:B TR
$37.40
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