MT53E128M16D1FW-046 AIT:A TR

Memory IC Overview

The Micron MT53E128M16D1FW-046 AIT:A TR is a mobile LPDDR4 dynamic random-access memory (DRAM) integrated circuit. It features a storage capacity of 2 Gbit organized as 128 M x 16 bits with a 16-bit data bus width. The device supports a maximum clock frequency of 2.133 GHz and operates within a supply voltage range of 1.06 V to 1.17 V. It is housed in a 200-pin TFBGA package and is rated for an industrial operating temperature range from -40°C to +95°C.

Memory IC Feature Summary

• Supports high-speed parallel interface operation up to 2.133 GHz
• Designed for mobile applications with low power consumption characteristics
• Industrial temperature rating ensures reliable performance in extended environments

Memory IC Applications

• Mobile computing platforms requiring high bandwidth
• Smartphones and tablets utilizing LPDDR4 memory standards
• Embedded systems operating within specified thermal limits

Memory IC Procurement Notes

Verify component authenticity through authorized Micron distributors or certified suppliers. Confirm the specific suffix AIT:A matches required temperature and speed grades. Check for moisture sensitivity labeling and handling requirements prior to assembly. Ensure the reel packaging condition meets storage guidelines to prevent damage during transit and installation processes.

Memory IC Selection Notes

Select this part when a 2 Gbit LPDDR4 configuration with a 16-bit interface is required. The industrial temperature range (-40°C to +95°C) suits demanding operational environments. Compare against other MT53E variants for density and pin compatibility. Ensure system design supports the 1.1 V nominal supply voltage and signal integrity requirements for 2.133 GHz operation.

Memory IC Part Context

This component belongs to the Micron MT53E series of mobile LPDDR4 DRAM devices. The series offers various densities and organizational configurations tailored for portable electronics. The 200-TFBGA package provides a compact form factor suitable for space-constrained mobile designs while maintaining electrical performance standards defined by the JEDEC LPDDR4 specification.

Memory IC Replacement Considerations

Direct substitutes include other Micron MT53E128M16D1 variants with compatible packages and electrical specifications. Verify that alternative parts match the 200-TFBGA footprint and 16-bit bus width. Cross-reference temperature ranges and access times to ensure functional equivalence in the target application.