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MT53E1G64D4SP-046 WT:C TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 64GBIT BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MT53E1G64D4SP-046 WT:C TR
- Description：IC DRAM 64GBIT BGA
- Series：-
- Mfr：Micron Technology Inc.
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：DRAM
- Technology：SDRAM - Mobile LPDDR4
- Memory Size：64Gbit
- Memory Organization：1G x 64
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MT53E1G64D4SP-046 WT:C TR
Memory IC Overview
The Micron MT53E1G64D4SP-046 WT:C TR is a mobile LPDDR4 SDRAM component with a total storage capacity of 64 Gbit. It features a 64-bit data bus width and operates at a maximum clock frequency of 2.133 GHz. The device is organized as 1 G x 64 and utilizes a VFBGA-556 package for surface mount installation. Electrical specifications include a minimum power supply voltage of 1.06 V and a maximum of 1.95 V. The operational temperature range spans from -25 C to +85 C.
Memory IC Feature Summary
- Supports LPDDR4 interface standards for mobile applications
- Provides high-density memory organization within a compact footprint
- Enables surface mount technology integration
Memory IC Applications
- Mobile computing platforms
- Smartphone systems
- Tablet devices
Memory IC Procurement Notes
Verify the specific ordering suffix against official manufacturer documentation to confirm the tape and reel packaging configuration. Confirm current production status directly with Micron Technology, as availability may vary by region. Ensure compatibility with system voltage requirements before procurement.
Memory IC Selection Notes
Select this component when a 64 Gbit density with a 64-bit interface is required for space-constrained mobile designs. Verify that the host controller supports the LPDDR4 protocol and the specified 2.133 GHz speed grade. Ensure the PCB layout accommodates the VFBGA-556 package dimensions and thermal requirements.
Memory IC Part Context
This part belongs to the Micron MT53E series of mobile DRAM products. It represents a high-capacity solution designed for advanced mobile electronics requiring efficient power consumption and high bandwidth performance within strict physical size limitations typical of modern handheld devices.
Memory IC Replacement Considerations
Consult Micron official documentation for verified substitute part numbers. Cross-referencing requires matching density, bus width, package type, and electrical characteristics.
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