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MT53E384M32D2DS-046 WT:E is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 12GBIT 2.133GHZ 200WFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MT53E384M32D2DS-046 WT:E
- Description：IC DRAM 12GBIT 2.133GHZ 200WFBGA
- Series：-
- Mfr：Micron Technology Inc.
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - Mobile LPDDR4
- Memory Size：12Gbit
- Memory Organization：384M x 32
- Memory Interface：-
- Clock Frequency：2.133 GHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.1V
- Operating Temperature：-30°C ~ 85°C (TC)
- Mounting Type：Surface Mount
- Package / Case：200-WFBGA
- Supplier Device Package：200-WFBGA (10x14.5)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MT53E384M32D2DS-046 WT:E
Memory IC Overview
The Micron MT53E384M32D2DS-046 WT:E is a mobile LPDDR4 SDRAM component with a total storage capacity of 12 Gbit. It features a 32-bit data bus width and an organization of 384 M x 32. The device supports a maximum clock frequency of 2.133 GHz and has an access time of 3.5 ns. Operating voltage ranges from 1.06 V to 1.95 V, with a typical supply of 1.1 V. It is housed in a 200-WFBGA package and operates within a temperature range of -40°C to +105°C.
Memory IC Feature Summary
- Supports high-speed data transfer via LPDDR4 interface technology
- Designed for mobile applications requiring low power consumption
- Utilizes wide I/O architecture for efficient bandwidth utilization
Memory IC Applications
- Smartphones and mobile communication devices
- Tablets and portable computing systems
- Wearable electronics with memory constraints
Memory IC Procurement Notes
Verify the specific suffix and packaging configuration against official Micron documentation before procurement. Confirm current lifecycle status as distribution channels may list obsolete or discontinued variants. Ensure compatibility with system voltage requirements and thermal management specifications for the intended operating environment.
Memory IC Selection Notes
Select this component when a 12 Gbit density with a 32-bit interface is required for mobile form factors. Consider the extended industrial temperature range (-40°C to +105°C) for ruggedized applications. Evaluate pinout compatibility and signal integrity requirements for the 200-WFBGA package during PCB layout design.
Memory IC Part Context
This part belongs to the Micron MT53E series of mobile LPDDR4 DRAMs. It shares architectural similarities with other members like the MT53E128M32D2DS and MT53E768M32D4DT, differing primarily in density and package options. The series targets high-performance mobile platforms requiring efficient power management.
Memory IC Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Consult Micron's official obsolescence notices or authorized distributor databases for verified cross-references.
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