MT58L32L32PT-10

Memory IC Overview

The MT58L32L32PT-10 is a 1Mbit (32K x 32) Zero Bus Turnaround (ZBT) SRAM manufactured by Micron Technology Inc. It operates at a maximum clock frequency of 100 MHz with a typical access time of 5 ns. The device utilizes a 3.3V supply voltage and features a parallel interface. It is housed in a 100-pin TQFP package measuring 14x20.1 mm, designed for high-speed data buffering and cache applications requiring low latency.

Memory IC Feature Summary

• Zero Bus Turnaround architecture enables continuous data transfer without wait states during bus direction changes
• Pipelined architecture supports high-frequency operation up to 100 MHz
• Compatible with standard 3.3V CMOS logic levels for system integration

Memory IC Applications

• High-speed data buffering in network equipment
• Cache memory for embedded processors
• Real-time data acquisition systems

Memory IC Procurement Notes

Verify the specific suffix 'PT' confirms the 100-TQFP package and '-10' denotes the 10ns/5ns speed grade. Confirm manufacturer origin as Micron Technology Inc. to avoid counterfeit components. Ensure the part matches the required 3.3V operating voltage and parallel interface specifications for your design.

Memory IC Selection Notes

Select this component when zero bus turnaround performance is critical for maintaining throughput in bidirectional data paths. Compare against standard asynchronous SRAMs if lower power consumption is prioritized over speed. Ensure the 100-pin TQFP footprint fits the PCB layout constraints.

Memory IC Part Context

This part belongs to Micron's ZBT SRAM family, which bridges the gap between asynchronous SRAMs and synchronous SRAMs. It offers faster turnaround times than asynchronous devices while consuming less power than synchronous alternatives. The MT58L32L32 series provides density options for various buffering needs.

Memory IC Replacement Considerations

The MT58L32L32PT-10IT is an industrial temperature variant of the same electrical specification. Verify pin compatibility and thermal requirements before substituting.