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MT60B2G8RZ-56B IT:D is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 16GBIT POD 78FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MT60B2G8RZ-56B IT:D
- Description：IC DRAM 16GBIT POD 78FBGA
- Series：-
- Mfr：Micron Technology Inc.
- Package：Bulk
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - DDR5
- Memory Size：16Gbit
- Memory Organization：2G x 8
- Memory Interface：POD
- Clock Frequency：2.8 GHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 95°C (TC)
- Mounting Type：Surface Mount
- Package / Case：78-VFBGA
- Supplier Device Package：78-FBGA (7.5x11)
- Access Time：16 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MT60B2G8RZ-56B IT:D
Memory IC Overview
The MT60B2G8RZ-56B IT:D is a DDR5 SDRAM component with a 16 Gbit density and x8 organization. It operates at a maximum clock frequency of 2.8 GHz (5600 MT/s) within an industrial temperature range of -40°C to +95°C. The device utilizes a 78-ball VFBGA package measuring 7.50 mm x 11.00 mm x 1.00 mm. Standard I/O voltage is 1.1V, with a CAS Latency of CL=46.
Memory IC Feature Summary
- Supports high-speed data transfer rates up to 5600 MT/s compliant with JEDEC standards.
- Designed for industrial environments with extended operating temperature capabilities.
- Features a compact 78-ball VFBGA surface-mount package for space-constrained applications.
Memory IC Applications
- High-performance computing systems
- Data center infrastructure
- Enterprise server memory modules
Memory IC Procurement Notes
Verify current availability status as this part may be subject to end-of-life transitions or supply constraints. Confirm the specific suffix 'IT:D' matches the required temperature grade and speed bin. Ensure compatibility with host controllers supporting DDR5 specifications before procurement.
Memory IC Selection Notes
Select this component for designs requiring 16 Gbit capacity in an x8 configuration. The industrial temperature rating (-40°C to +95°C) distinguishes it from commercial variants. Verify that the PCB layout supports the 78-ball VFBGA footprint and that the system power delivery accommodates the 1.1V I/O requirement.
Memory IC Part Context
This component belongs to Micron's DDR5 SDRAM family, succeeding previous generation technologies. It is engineered to provide higher bandwidth and improved power efficiency compared to DDR4 alternatives. The part is intended for use in main memory subsystems where high throughput and reliability are critical.
Memory IC Replacement Considerations
Consult official substitution lists for equivalent density and speed parts. Verify pinout compatibility and electrical characteristics before replacing with alternative vendors or newer revisions.
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