MT61K512M32KPA-16:C

Memory IC Overview

The Micron MT61K512M32KPA-16:C is a GDDR6 SGRAM component with a 16 Gbit storage capacity and a 32-bit data bus width. It features a maximum clock frequency of 2 GHz and operates within a supply voltage range of 1.3095 V to 1.3905 V. The device utilizes a 180-ball TFBGA package and supports an operating temperature range from 0°C to +95°C.

Memory IC Feature Summary

• Supports high-speed data transfer via GDDR6 interface technology
• Provides 16 Gbit memory density in a compact surface-mount package
• Operates at elevated temperatures up to 95°C for robust performance

Memory IC Applications

• High-performance graphics processing units
• Advanced display controller systems
• Network infrastructure equipment requiring high bandwidth

Memory IC Procurement Notes

Verify current manufacturing status directly with the manufacturer, as lifecycle information may be incomplete. Confirm moisture sensitivity level handling requirements prior to assembly. Ensure compatibility with system power delivery specifications regarding the 1.3V nominal voltage range. Validate thermal management solutions for operation up to 95°C junction temperature.

Memory IC Selection Notes

Select this component when a 32-bit wide GDDR6 interface is required for high-bandwidth applications. The 16 Gbit density suits designs needing substantial frame buffer or cache memory. Verify that the PCB layout supports the 180-ball TFBGA footprint and that the system environment remains within the specified commercial temperature range.

Memory IC Part Context

This part belongs to the Micron MT61K512 series of GDDR6 memory devices. These components are designed for demanding visual computing and networking applications. The specific suffix indicates the speed bin and package variant within the broader family of high-density dynamic random-access memory products.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation.