MT62F2G32D4DS-023 WT:B TR

$41.49

Description：IC DRAM 64GBIT PAR 200WFBGA
Series：-
Mfr：Micron Technology Inc.
Package：Tape & Reel (TR)

SKU:c1dfed2be6a6 Category: Memory IC Brand: Micron Technology Inc.

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Product introduction

MT62F2G32D4DS-023 WT:B TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 64GBIT PAR 200WFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT62F2G32D4DS-023 WT:B TR

Description：IC DRAM 64GBIT PAR 200WFBGA
Series：-
Mfr：Micron Technology Inc.
Package：Tape & Reel (TR)
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - Mobile LPDDR5
Memory Size：64Gbit
Memory Organization：2G x 32
Memory Interface：Parallel
Clock Frequency：2.133 GHz
Write Cycle Time - Word, Page：-
Voltage - Supply：1.05V
Operating Temperature：-25°C ~ 85°C
Mounting Type：Surface Mount
Package / Case：200-WFBGA
Supplier Device Package：200-WFBGA (10x14.5)
Grade：-
Qualification：-

Memory IC datasheet and documents for MT62F2G32D4DS-023 WT:B TR

MT62F2G32D4DS-023 WT:B TR

Memory IC Overview

The Micron MT62F2G32D4DS-023 WT:B TR is a mobile LPDDR5 SDRAM with a total density of 64 Gbit, organized as 2 Gbit x 32. It operates at a maximum clock frequency of 4.266 GHz and supports data rates up to 8533 MT/s per pin. The device utilizes a TFBGA-315 package and functions within a voltage range of 1.01 V to 1.12 V. It is designed for high-bandwidth applications in mobile platforms.

Memory IC Feature Summary

Supports LPDDR5 interface with differential command clocks for high-speed operation
Features programmable CAS latency and selectable burst lengths
Includes partial array self-refresh capabilities for power management
Integrates optional link protection via Link ECC

Memory IC Applications

Smartphones and mobile devices requiring high memory bandwidth
Tablets and portable computing systems
Mobile AI and machine learning accelerators
High-performance embedded mobile platforms

Memory IC Procurement Notes

Verify component authenticity through authorized Micron distributors or direct manufacturer channels. Confirm lot traceability and RoHS compliance status prior to integration. Ensure storage conditions adhere to moisture sensitivity level requirements. Validate packaging integrity against shipping damage risks. Cross-reference ordering suffixes to confirm specific tape-and-reel quantities and handling specifications.

Memory IC Selection Notes

Select this component when designing systems requiring 64 Gbit capacity with x32 bus width. Ensure the host controller supports LPDDR5 signaling standards and 4.266 GHz speeds. Verify that the PCB layout accommodates the TFBGA-315 footprint. Confirm thermal management strategies for the specified operating temperature range. Check compatibility with system power delivery networks for 1.01 V to 1.12 V operation.

Memory IC Part Context

This part belongs to Micron's LPDDR5 family, succeeding previous generations like LPDDR4X. It targets next-generation mobile processors demanding higher throughput and lower power consumption. The 315-ball TFBGA form factor optimizes board space for slim consumer electronics. It complements other Micron DRAM solutions by providing scalable density options.