Memory IC MT62F2G32D4DS-026 AIT:B TR product image

MT62F2G32D4DS-026 AIT:B TR

$49.84
  • Description:IC DRAM 64GBIT PAR 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:3405c168291d Category: Brand:

  
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MT62F2G32D4DS-026 AIT:B TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 64GBIT PAR 200WFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT62F2G32D4DS-026 AIT:B TR

  • Description:IC DRAM 64GBIT PAR 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR5
  • Memory Size:64Gbit
  • Memory Organization:2G x 32
  • Memory Interface:Parallel
  • Clock Frequency:3.2 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.05V
  • Operating Temperature:-40°C ~ 95°C
  • Mounting Type:Surface Mount
  • Package / Case:200-WFBGA
  • Supplier Device Package:200-WFBGA (10x14.5)
  • Grade:Automotive
  • Qualification:AEC-Q100

Memory IC datasheet and documents for MT62F2G32D4DS-026 AIT:B TR

MT62F2G32D4DS-026 AIT:B TR

Memory IC Overview

The Micron MT62F2G32D4DS-026 AIT:B TR is a Low Power Double Data Rate Type 5 (LPDDR5) dynamic random-access memory component. It features a total storage capacity of 64 Gbit, organized as two banks of 2 Gbits with a 32-bit data bus width per bank. The device utilizes a 315-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package designed for surface-mount technology applications.

Memory IC Feature Summary

  • Supports LPDDR5 interface standards for high-speed mobile data processing
  • Optimized for low power consumption in portable electronic devices
  • Designed for compact form factor integration via TFBGA packaging

Memory IC Applications

  • Smartphones and mobile communication devices
  • Tablets and handheld computing platforms
  • Mobile broadband modules

Memory IC Procurement Notes

Verify the specific suffix 'AIT:B' against official Micron documentation to confirm temperature range and speed binning. Confirm the 'TR' designation indicates tape-and-reel packaging. Ensure compatibility with host controller LPDDR5 PHY specifications before procurement.

Memory IC Selection Notes

Select this part for designs requiring 64 Gbit density within a 315-ball footprint. Verify that the system environment supports the operating voltage and thermal requirements specified for the AIT grade. Compare against other LPDDR5 densities if board space allows for alternative pin counts.

Memory IC Part Context

This component belongs to Micron's LPDDR5 family, succeeding previous LPDDR4X generations. It targets the mobile market segment, offering improved bandwidth efficiency and power savings compared to legacy DRAM technologies. The numbering follows Micron's standard part identification structure for mobile memory solutions.

Memory IC Replacement Considerations

Consult Micron's official cross-reference guides for verified substitutes. Generic equivalents may not match the specific electrical characteristics or timing parameters required by the host system.

MT62F2G32D4DS-026 AIT:B TRMT62F2G32D4DS-026 AIT:B TR
$49.84
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