Memory IC MT62F2G64D8EK-023 FAAT:C product image

MT62F2G64D8EK-023 FAAT:C

$109.62
  • Description:IC DRAM 128GBIT PAR 441TFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Box

SKU:ba0ddff815a3 Category: Brand:

  
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MT62F2G64D8EK-023 FAAT:C is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 128GBIT PAR 441TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT62F2G64D8EK-023 FAAT:C

  • Description:IC DRAM 128GBIT PAR 441TFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Box
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR5
  • Memory Size:128Gbit
  • Memory Organization:2G x 64
  • Memory Interface:Parallel
  • Clock Frequency:4.266 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.05V
  • Operating Temperature:-40°C ~ 105°C
  • Mounting Type:Surface Mount
  • Package / Case:441-TFBGA
  • Supplier Device Package:441-TFBGA (14x14)
  • Grade:Automotive
  • Qualification:AEC-Q100

Memory IC datasheet and documents for MT62F2G64D8EK-023 FAAT:C

MT62F2G64D8EK-023 FAAT:C

Memory IC Overview

The Micron MT62F2G64D8EK-023 FAAT:C is a mobile LPDDR5 SDRAM component with a total storage capacity of 128 Gbit. It features a 64-bit data bus width and supports a maximum clock frequency of 4.266 GHz. The device utilizes a 441-ball TFBGA package measuring 14x14 mm. Operating voltage ranges from 1.01 V to 1.12 V, with an I/O voltage of 0.5 V. The commercial temperature range spans from -25°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed parallel interface for mobile applications
  • Integrates on-die termination and data bus inversion
  • Features dynamic voltage and frequency scaling capabilities

Memory IC Applications

  • Smartphones and mobile devices
  • Tablets and portable electronics
  • Automotive infotainment systems

Memory IC Procurement Notes

Verify the specific suffix FAAT:C against official Micron documentation to confirm automotive qualification status and extended temperature ratings. Ensure compatibility with system power delivery requirements for the specified voltage range. Confirm package dimensions and pinout alignment with PCB layout specifications before integration.

Memory IC Selection Notes

Select this component for designs requiring high bandwidth within strict power constraints. Evaluate thermal management strategies for the TFBGA package under sustained load conditions. Compare against alternative densities if system memory architecture allows flexibility in bank organization and channel configuration.

Memory IC Part Context

This part belongs to Micron's LPDDR5 family, succeeding previous generations like LPDDR4X. It targets next-generation mobile platforms demanding higher throughput per watt. The 441-ball form factor balances density with board space efficiency for compact consumer electronics.

Memory IC Replacement Considerations

Consult official substitution lists for equivalent density parts such as MT62F2G64D8EK-023 AAT:B or WT:C variants. Verify that any substitute maintains identical pinout and electrical characteristics to ensure drop-in compatibility without redesign.

MT62F2G64D8EK-023 FAAT:CMT62F2G64D8EK-023 FAAT:C
$109.62
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