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MT62F3G32D8DV-023 WT:C is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 96GBIT LVSTL 315LFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MT62F3G32D8DV-023 WT:C
- Description：IC DRAM 96GBIT LVSTL 315LFBGA
- Series：-
- Mfr：Micron Technology Inc.
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - Mobile LPDDR5X
- Memory Size：96Gbit
- Memory Organization：3G x 32
- Memory Interface：LVSTL
- Clock Frequency：4.266 GHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.01V ~ 1.12V
- Operating Temperature：-25°C ~ 85°C (TC)
- Mounting Type：Surface Mount
- Package / Case：315-LFBGA
- Supplier Device Package：315-LFBGA (12.4x15)
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MT62F3G32D8DV-023 WT:C
Memory IC Overview
The MT62F3G32D8DV-023 WT:C is a mobile LPDDR5 SDRAM manufactured by Micron Technology Inc. It features a total storage capacity of 96 Gbit, organized as 3 Gbits x 32 bits. The device supports a maximum clock frequency of 4.266 GHz and operates within a voltage range of 1.01 V to 1.12 V. It is housed in an LFBGA-315 package with surface mount installation. The component is rated for industrial temperatures, functioning between -40°C and +105°C.
Memory IC Feature Summary
- Supports LPDDR5 technology for high-bandwidth data transfer
- Industrial temperature rating for extended operational reliability
- Parallel interface architecture for system integration
Memory IC Applications
- Mobile computing platforms
- High-performance embedded systems
- Industrial IoT devices
Memory IC Procurement Notes
Verify the specific suffix 'WT:C' against official Micron documentation to confirm exact speed binning and quality grade. Ensure compatibility with the target PCB footprint for the LFBGA-315 package. Confirm that the operating voltage requirements align with the system power design before procurement.
Memory IC Selection Notes
Select this component when a 96 Gbit density is required for mobile or embedded applications. The LPDDR5 interface offers higher efficiency compared to previous generations. Verify that the host controller supports the necessary LPDDR5 signaling standards and timing parameters for stable operation at the specified frequencies.
Memory IC Part Context
This part belongs to the Micron MT62F series of mobile DRAM products. The series utilizes advanced process technologies to deliver high performance in small form factors. The MT62F3G variant specifically targets applications requiring significant memory bandwidth within strict power constraints typical of modern portable electronics.
Memory IC Replacement Considerations
Consult Micron's official obsolescence notices for potential end-of-life status. If replacement is needed, verify cross-compatibility with other LPDDR5 parts from the same family, ensuring pinout and electrical specifications match exactly.
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