ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
MT62F4G32D8DV-023 FAAT:C is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 128GBIT LFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MT62F4G32D8DV-023 FAAT:C
- Description：IC DRAM 128GBIT LFBGA
- Series：-
- Mfr：Micron Technology Inc.
- Package：Tray
- Memory Type：-
- Memory Format：DRAM
- Technology：SDRAM - Mobile LPDDR5
- Memory Size：128Gbit
- Memory Organization：4G x 32
- Memory Interface：Parallel
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MT62F4G32D8DV-023 FAAT:C
Memory IC Overview
The Micron MT62F4G32D8DV-023 FAAT:C is a Mobile LPDDR5 SDRAM with a 128 Gbit capacity organized as 4G x 32 bits. It features a 32-bit data bus width and supports a maximum clock frequency of 4.266 GHz. The component utilizes an LFBGA-315 package for surface mount installation. Operating voltage ranges from 1.01 V to 1.12 V, ensuring efficient power management. The device is rated for an extended industrial temperature range, functioning reliably between -40°C and +105°C.
Memory IC Feature Summary
- Supports high-speed data transfer rates up to 4.266 GHz for enhanced mobile performance
- Optimized low-power architecture suitable for battery-operated devices
- Extended industrial temperature rating ensures reliability in harsh environments
Memory IC Applications
- Smartphones and tablets requiring high bandwidth memory
- Automotive infotainment systems operating in extreme temperatures
- Wearable technology with strict power constraints
Memory IC Procurement Notes
Verify the specific suffix 'FAAT:C' against official Micron documentation to confirm pinout and electrical characteristics match your design requirements. Ensure compatibility with your system's power delivery network given the 1.01V to 1.12V operating range. Confirm that the LFBGA-315 package dimensions align with your PCB footprint specifications before finalizing procurement decisions.
Memory IC Selection Notes
Select this component when designing systems requiring LPDDR5 speeds with a 32-bit interface. Consider the -40°C to +105°C temperature range if deploying in automotive or industrial sectors. Evaluate the 128 Gbit density against total system memory needs. Ensure the LFBGA-315 package is supported by your assembly capabilities and thermal management strategy for optimal performance.
Memory IC Part Context
This part belongs to Micron's LPDDR5 family, targeting next-generation mobile and embedded applications. It represents an evolution from previous generations, offering higher bandwidth and improved energy efficiency. The 315-pin LFBGA form factor allows for compact board designs while maintaining robust signal integrity for high-frequency operations typical in modern consumer electronics.
Memory IC Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Consult Micron's official obsolescence notices or authorized distributor databases for potential replacements if this specific variant becomes unavailable.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
