Memory IC MT62F512M32D1DS-026 WT:E TR product image

MT62F512M32D1DS-026 WT:E TR

$11.89
  • Description:IC DRAM 16GBIT PAR 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:a3dd72f699a9 Category: Brand:

  
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MT62F512M32D1DS-026 WT:E TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 16GBIT PAR 200WFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT62F512M32D1DS-026 WT:E TR

  • Description:IC DRAM 16GBIT PAR 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:-
  • Memory Format:-
  • Technology:-
  • Memory Size:-
  • Memory Organization:-
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  • Write Cycle Time - Word, Page:-
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Memory IC datasheet and documents for MT62F512M32D1DS-026 WT:E TR

MT62F512M32D1DS-026 WT:E TR

Memory IC Overview

The MT62F512M32D1DS-026 WT:E TR is a Micron LPDDR5 SDRAM component with a total storage capacity of 16 Gbit. It features a 32-bit data bus width and operates at a maximum clock frequency of 4.266 GHz. The device utilizes a TFBGA-315 package and is organized as 512 M x 32. Power supply requirements range from a minimum of 1.01 V to a maximum of 1.12 V. The operational temperature range spans from -25°C to +85°C.

Memory IC Feature Summary

  • Supports LPDDR5 interface for mobile applications
  • High-speed data transfer capability up to 4.266 GHz
  • Compact TFBGA-315 surface-mount packaging

Memory IC Applications

  • Mobile devices requiring high-bandwidth memory
  • AI-enabled smartphones and tablets
  • 5G network infrastructure components

Memory IC Procurement Notes

Verify the specific suffix 'WT:E' against official Micron documentation to confirm environmental compliance and material specifications. Confirm that the 'TR' designation aligns with required reel packaging standards for automated assembly processes. Ensure compatibility with system voltage rails within the 1.01 V to 1.12 V operating window before integration.

Memory IC Selection Notes

Select this part when a 16 Gbit density with a 32-bit interface is required for space-constrained mobile designs. The LPDDR5 technology offers improved power efficiency compared to previous generations. Verify that the -25°C to +85°C industrial temperature range meets the target application's thermal requirements.

Memory IC Part Context

This component belongs to Micron's LPDDR5 family, designed for next-generation mobile platforms. It succeeds earlier LPDDR4X solutions by providing higher bandwidth and lower power consumption. The MT62F512 series represents a specific density tier within the broader LPDDR5 portfolio aimed at premium smartphone and tablet markets.

Memory IC Replacement Considerations

Micron recommends MT62F1G32D2DS-020 WT:D TR as a manufacturer-recommended alternative. Verify pinout and electrical parameter compatibility before substitution.

MT62F512M32D1DS-026 WT:E TRMT62F512M32D1DS-026 WT:E TR
$11.89
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