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MT62F768M32D2DS-026 WT:B TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 24GBIT LVSTL. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MT62F768M32D2DS-026 WT:B TR
- Description：IC DRAM 24GBIT LVSTL
- Series：-
- Mfr：Micron Technology Inc.
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：DRAM
- Technology：SDRAM - Mobile LPDDR5
- Memory Size：24Gbit
- Memory Organization：768M x 32
- Memory Interface：LVSTL
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MT62F768M32D2DS-026 WT:B TR
Memory IC Overview
The MT62F768M32D2DS-026 WT:B TR is a Micron LPDDR5 SDRAM component with a total storage capacity of 24 Gbit. It features a 32-bit data bus width and an organization of 768 M x 32. The device utilizes a TFBGA-315 package for surface mount installation. Operating voltage ranges from 1.7 V to 1.95 V, with a functional temperature range spanning from -25°C to +85°C.
Memory IC Feature Summary
- Supports LPDDR5 mobile memory interface standards
- Provides high-density data storage in a compact form factor
- Designed for surface-mount technology integration
Memory IC Applications
- Mobile computing devices
- Embedded systems requiring low-power memory
- Portable electronic equipment
Memory IC Procurement Notes
Verify the specific suffix WT:B against official Micron documentation to confirm exact electrical characteristics and packaging details. Confirm availability status as distribution channels may indicate limited supply or regional restrictions. Ensure compatibility with system power requirements before procurement.
Memory IC Selection Notes
Select this part when a 24 Gbit density with a 32-bit interface is required within the specified thermal and voltage constraints. Compare against other LPDDR5 options based on package dimensions and operating temperature ranges to ensure fit for the target application environment.
Memory IC Part Context
This component belongs to the Micron LPDDR5 family, designed for mobile and embedded applications. It represents a generation of high-bandwidth, low-power dynamic random-access memory suitable for modern portable electronics and compact computing platforms requiring efficient data handling.
Memory IC Replacement Considerations
Consult Micron datasheets for direct substitutes with identical pinouts and specifications. Verify that any alternative maintains the same 32-bit width and 24 Gbit capacity to ensure seamless integration without board redesign.
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