MT62F768M64D4EK-023 AUT:B TR

Memory IC Overview

The Micron MT62F768M64D4EK-023 AUT:B TR is a mobile LPDDR5 SDRAM component with a total storage capacity of 48 Gbit. It features a 64-bit data bus width and operates at a maximum clock frequency of 4.266 GHz. The device is organized as 768 M x 64 and utilizes a TFBGA-441 package for surface mount installation. Electrical specifications include a minimum supply voltage of 1.01 V and a maximum of 1.12 V. The operational temperature range spans from -40°C to +125°C, supporting automotive-grade environments.

Memory IC Feature Summary

• Supports high-speed parallel data transfer via the LPDDR5 interface standard.
• Designed for compact form factors using a thin-profile ball grid array package.
• Capable of operating within extended industrial and automotive temperature ranges.

Memory IC Applications

• Automotive infotainment systems
• Advanced driver-assistance systems (ADAS)
• Mobile computing platforms requiring high bandwidth

Memory IC Procurement Notes

Verify the specific suffix 'TR' against official Micron documentation to confirm tape-and-reel packaging status, as distributor listings may vary. Confirm the AUT:B qualification level matches project requirements. Check current lifecycle status directly with the manufacturer or authorized distributors, as availability information in third-party catalogs may be outdated or inaccurate.

Memory IC Selection Notes

Select this part when a 48 Gbit density with a 64-bit interface is required for space-constrained designs. Ensure the host controller supports LPDDR5 signaling rates up to 4.266 GHz. Verify that the system power delivery can maintain voltages between 1.01 V and 1.12 V under load. Confirm thermal management strategies are adequate for operation up to 125°C ambient or junction temperatures.

Memory IC Part Context

This component belongs to the Micron MT62F series of mobile LPDDR5 DRAM devices. These parts are engineered to deliver high bandwidth and improved power efficiency compared to previous generations. The series targets applications demanding significant memory throughput within strict physical size limitations typical of modern portable and automotive electronics.

Memory IC FAQ

What is the organizational structure of the memory die?

The device is organized as 768 Megabytes by 64 bits (768 M x 64).

Does this part support automotive temperature grades?

Yes, the AUT:B suffix indicates qualification for an extended operating temperature range from -40°C to +125°C.