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The MediaTek MT6358W/A is a specialized Power Management Integrated Circuit (PMIC) designed for smart phone applications. It operates within a supply voltage range of 3.15V to 5V and draws a supply current of 750µA. The component functions as part of the Genio 500 series ecosystem, providing essential power management capabilities. It is housed in a 194-WLCSP package with dimensions of 6.4x6 mm, suitable for surface mount mounting. The device supports an operating temperature range from -40°C to 85°C (TA).
Verify the exact datasheet specifications directly from MediaTek before integration, as distributor images are representations only. Confirm the package type is 194-WLCSP (6.4x6) and that the operating temperature range meets your environmental requirements. Ensure compatibility with the Genio 500 SoC ecosystem if used in that context. Check for RoHS compliance details in the official documentation.
Select this PMIC when designing for MediaTek-based smartphone or IoT platforms requiring integrated power sequencing and battery charging. The 194-WLCSP package is suitable for space-constrained designs. Verify that the 3.15V to 5V input range aligns with your system's power source. Consider the -40°C to 85°C operating range for industrial or consumer environments.
The MT6358W/A is categorized under Power Management Specialized ICs and is associated with the Genio 500 System-on-Chip family. It serves as a companion chip for managing power distribution in mobile and IoT applications. The component is manufactured by MediaTek and is currently listed as active. It falls under ECCN 5A991G and HTSUS 8542.39.0070 classifications.
Publicly confirmed substitute part numbers are not available in the provided data. Consult MediaTek for potential alternatives or newer revisions within the Genio series. Ensure any replacement maintains the 194-WLCSP footprint and electrical characteristics.
It is a power management IC that controls voltage regulation, power sequencing, and battery charging for MediaTek-based smartphones and IoT devices.
The component uses a 194-WLCSP (Wafer-Level Chip Scale Package) with dimensions of 6.4x6 mm.