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MT8395IV/ZA is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists MediaTek. Its product description is GENIO 1200 SOC INDUSTRIAL TEMP. Review the specifications below when checking this part for your BOM.
The MediaTek MT8395IV/ZA is an IoT application processor belonging to the Genio 1200 series. It integrates a quad-core ARM Cortex-A55 and Cortex-A78 CPU cluster with operating frequencies of 2GHz and 2.2GHz respectively. The SoC includes a Mali-G57 MC2 GPU, HiFi 4 DSP, and MDLA AI Processor Unit. It supports LPDDR4X memory interfaces and features extensive connectivity options including Ethernet, USB 3.0, PCIe, and MIPI interfaces for display and camera. The component is housed in a 1046-ball VFBGA package (15x15mm) and operates within a junction temperature range of -20°C to 105°C.
Verify the specific suffix 'IV' against the official ordering information table to confirm the operating temperature range and package variant. Ensure that the required thermal dissipation design aligns with the specified junction temperature limits provided in the datasheet thermal specifications section.
Select this model when high-performance computing is required alongside low-power idle states for IoT applications. Confirm compatibility with LPDDR4X memory modules and verify that the target enclosure can accommodate the 1046-VFBGA footprint while maintaining adequate airflow for the specified thermal envelope.
This part is part of the MediaTek Genio 1200 family, designed to bridge the gap between entry-level microcontrollers and high-end smartphones. It shares architectural similarities with other Genio series chips but offers specific performance tiers through its mixed-cluster CPU configuration and dedicated AI acceleration hardware.
Direct pin-to-pin replacements are not explicitly listed in the public documentation. Evaluate alternative Genio series models based on core count and clock speed requirements, ensuring software driver support remains compatible with the existing firmware architecture.
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