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MTB1-7PL93 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists ITT Cannon, LLC. Its product description is CONN HEADER VERT 7POS 1.27MM. Review the specifications below when checking this part for your BOM.
The ITT Cannon MTB1-7PL93 is a rectangular connector header belonging to the male pins category. It features a vertical through-hole mounting style with seven positions. The contact pitch is specified as 0.050 inches, equivalent to 1.27 millimeters. This component is designed for board-to-board or cable-to-board interconnection applications requiring reliable signal transmission in standard electronic assemblies.
Verify the exact part number against official ITT Cannon documentation before ordering. Confirm that the vertical header configuration and 1.27mm pitch match your design requirements. Ensure compatibility with mating connectors regarding gender and contact arrangement. Request current datasheets from authorized distributors to validate specifications prior to procurement.
Select this component when a vertical male header with a 1.27mm pitch is required for through-hole assembly. Consider the seven-position count for circuit density needs. Evaluate the mechanical strength of through-hole mounting versus surface mount alternatives. Verify that the header material and plating meet environmental and conductivity standards for the intended application.
This part belongs to ITT Cannon's extensive portfolio of interconnect solutions. The company manufactures various connector series including circular MIL spec, D-Sub, and APD types. The MTB1 series represents their rectangular header offerings, focusing on standard pitch connections for general-purpose electronic integration across multiple industries.
Consult official ITT Cannon substitution guides for verified equivalents. Generic headers may differ in pitch tolerance or contact material. Ensure any substitute maintains the 1.27mm spacing and vertical form factor. Cross-reference mating connector compatibility to prevent interface failures during assembly.
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