MTB1-9PAL61

Headers, Male Pins Overview

The MTB1-9PAL61 is a microminiature rectangular connector manufactured by ITT Cannon, LLC. It features 9 positions with a 0.050-inch (1.27mm) pitch. The connector utilizes solder termination for wire sizes ranging from 24 to 32 AWG. Contact surfaces are gold-plated to ensure reliable signal transmission in demanding environments.

Headers, Male Pins Feature Summary

• Microminiature form factor designed for high-density interconnect applications
• Gold-plated contacts provide corrosion resistance and stable electrical performance
• Solder tail construction ensures secure mechanical attachment to printed circuit boards

Headers, Male Pins Applications

• Aerospace and defense avionics systems
• Medical instrumentation and diagnostic equipment
• Industrial automation control panels

Headers, Male Pins Procurement Notes

Verify the specific suffix configuration against the official ITT Cannon datasheet to confirm contact plating thickness and material specifications. Ensure compatibility with mating housing components within the MTB series before finalizing procurement orders to prevent interface mismatches.

Headers, Male Pins Selection Notes

Select this component when space constraints require a compact rectangular interface with robust solder termination. Evaluate the 24-32 AWG wire gauge range to ensure proper crimping or stripping dimensions. Confirm that the operating environment does not exceed the thermal limits of the standard plastic housing materials.

Headers, Male Pins Part Context

This part belongs to the MTB series of microminiature connectors, which are widely utilized in military and aerospace sectors. The series offers various pin counts and termination styles, providing engineers with flexible solutions for board-to-board and cable-to-board connections requiring high reliability.

Headers, Male Pins Replacement Considerations

Direct substitutes may include other ITT Cannon MTB series variants with matching pin counts. Cross-brand replacements require careful verification of footprint dimensions, pin spacing, and locking mechanisms to maintain system integrity without redesigning the host PCB layout.