ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
MTFC1AAD3TD-DC FS17M TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is MTFC1AAD3TD-DC FS17M TR. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MTFC1AAD3TD-DC FS17M TR
- Description：MTFC1AAD3TD-DC FS17M TR
- Series：-
- Mfr：Micron Technology Inc.
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MTFC1AAD3TD-DC FS17M TR
Memory IC Overview
The MTFC1AAD3TD-DC FS17M TR is a Universal Flash Storage (UFS) memory integrated circuit manufactured by Micron Technology Inc. It belongs to the UFS product category and is designed for high-performance data storage applications. The component utilizes a TFBGA package configuration, which facilitates compact integration into mobile and embedded systems. This specific part number represents a variant within Micron's UFS lineup, offering standardized interface protocols for reliable communication with host processors.
Memory IC Feature Summary
- Supports Universal Flash Storage protocol for high-speed data transfer
- Utilizes TFBGA package for space-efficient board integration
- Designed for embedded mobile and consumer electronic applications
Memory IC Applications
- Smartphones and tablets
- Wearable devices
- Embedded computing systems
Memory IC Procurement Notes
Verify the exact suffix and marking code against official Micron documentation to ensure compatibility with your design requirements. Confirm availability status directly with authorized distributors as supply levels fluctuate. Ensure that the ordering information matches the specific package and temperature grade required for your application environment.
Memory IC Selection Notes
Select this component based on its UFS interface compatibility and form factor suitability for your target device. Evaluate the pinout and electrical specifications against your system's power and signal integrity requirements. Consider the thermal performance of the TFBGA package in relation to your enclosure design constraints.
Memory IC Part Context
This component is part of Micron's broader portfolio of flash memory solutions, specifically targeting the growing demand for fast, non-volatile storage in portable electronics. It complements other UFS variants by providing a specific capacity and interface option within the company's standard product line.
Memory IC Replacement Considerations
Consult Micron's official cross-reference guides or contact technical support for verified substitute part numbers. Do not assume functional equivalence with other UFS models without verifying pinouts, timing parameters, and firmware compatibility.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
