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MTFC256GAOAMAM-WT is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 2TBIT MMC. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MTFC256GAOAMAM-WT
- Description：IC FLASH 2TBIT MMC
- Series：e•MMC™
- Mfr：Micron Technology Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND
- Memory Size：2Tbit
- Memory Organization：256G x 8
- Memory Interface：MMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-25°C ~ 85°C (TA)
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MTFC256GAOAMAM-WT
Memory IC Overview
The Micron MTFC256GAOAMAM-WT is a 256GB e.MMC component utilizing TLC NAND technology. It adheres to the MMC v5.1 protocol and features a 153-ball package with dimensions of 11.50 x 13.00 x 1.30 mm. The device operates within an industrial temperature range of -25°C to +85°C. Key specifications include a component configuration of 256Gb x8, a dry pack quantity of 1520, and a tape & reel quantity of 2000.
Memory IC Feature Summary
- Industrial-grade thermal stability for demanding environments
- High-density storage via TLC NAND architecture
- Standardized interface compatibility through MMC v5.1 protocol
Memory IC Applications
- Industrial embedded systems requiring robust data retention
- Automotive infotainment and telematics units
- Consumer electronics with extended operational temperature needs
Memory IC Procurement Notes
Verify the specific suffix 'WT' against the official Micron datasheet to confirm the industrial temperature rating (-25°C to +85°C) and ensure it matches your design requirements. Confirm that the 153-ball GREEN package dimensions align with your PCB footprint constraints. Cross-reference the latest revision status to ensure production availability before finalizing procurement plans.
Memory IC Selection Notes
Select this component when high capacity is required alongside wide temperature tolerance in a compact form factor. The e.MMC interface simplifies integration compared to parallel NAND solutions. Ensure the host controller supports the MMC v5.1 standard to leverage full performance capabilities. Consider the 256GB density for applications needing substantial local storage without increasing board space.
Memory IC Part Context
This part belongs to Micron's e.MMC family, designed for mobile and embedded applications. It integrates NAND flash memory and a controller into a single package. The 'WT' designation typically indicates industrial temperature grading, distinguishing it from commercial variants. This series offers a balance of performance, reliability, and power efficiency for modern embedded designs.
Memory IC Replacement Considerations
Check for direct substitutes within the MTFC256GAOAMAM series with different suffixes if temperature ranges differ. Verify pin-to-pin compatibility with existing designs when considering alternative vendors. Consult Micron documentation for any obsolescence notices or recommended upgrades within the same capacity class.
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