Memory IC MTFC32GJVED-3F WT product image

MTFC32GJVED-3F WT

  • Description:IC FLASH 256GBIT MMC 169VFBGA
  • Series:e•MMC™
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:f3c6a3a882c0 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

MTFC32GJVED-3F WT is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 256GBIT MMC 169VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MTFC32GJVED-3F WT

  • Description:IC FLASH 256GBIT MMC 169VFBGA
  • Series:e•MMC™
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND
  • Memory Size:256Gbit
  • Memory Organization:32G x 8
  • Memory Interface:MMC
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-25°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:169-VFBGA
  • Supplier Device Package:169-VFBGA (14x18)
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MTFC32GJVED-3F WT

MTFC32GJVED-3F WT

Memory IC Overview

The Micron MTFC32GJVED-3F WT is a 256Gb NAND flash memory IC compliant with JEDEC e.MMC standard version 5.1. It integrates an MMC controller and NAND flash in a 169-VFBGA package (14x18 mm). The device operates at a clock frequency of 200 MHz with a supply voltage range of 2.7V to 3.6V. It supports automotive grade applications, certified to AEC-Q100 standards, and functions within a temperature range of -40°C to 105°C.

Memory IC Feature Summary

  • Integrates MultiMediaCard controller and NAND flash for embedded storage
  • Compliant with JEDEC/MMC standard version 5.1
  • Automotive grade certification (AEC-Q100)
  • High-speed interface supporting 200 MHz clock frequency

Memory IC Applications

  • Automotive infotainment systems
  • Embedded multimedia devices
  • Industrial control systems requiring high reliability
  • Consumer electronics with strict environmental tolerances

Memory IC Procurement Notes

Verify the specific suffix '3F' against official Micron documentation to confirm pinout and electrical characteristics, as suffixes often denote package or temperature variations. Ensure compatibility with your system's voltage levels (2.7V–3.6V) and interface requirements. Confirm AEC-Q100 certification if deploying in automotive contexts. Cross-reference the 169-VFBGA footprint dimensions (14x18 mm) with your PCB layout guidelines to ensure mechanical fit.

Memory IC Selection Notes

Select this component when a high-density, automotive-grade e.MMC solution is required. It is suitable for designs needing robust performance in varying temperatures (-40°C to 105°C). Compare against other MTFC32G variants based on package type (VFBGA vs TFBGA) and specific speed grades. Ensure the host controller supports e.MMC v5.1 protocol for optimal functionality.

Memory IC Part Context

This part belongs to Micron’s MTFC32G family of 256Gb e.MMC devices. These components are designed for embedded applications requiring non-volatile storage with integrated controllers. The family offers various package options and speed grades to suit different form factors and performance needs in mobile and automotive sectors.

Memory IC Replacement Considerations

Direct substitutes include other MTFC32G variants such as MTFC32GJUED-3F WT or MTFC32GJTED-3F WT, provided the package and speed grade match. Verify that any replacement maintains the same 169-VFBGA footprint and AEC-Q100 qualification if automotive use is intended.

MTFC32GJVED-3F WTMTFC32GJVED-3F WT

Click on the inquiry