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MTFC32GJWDQ-4L AIT Z TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 256GBIT MMC 100LBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MTFC32GJWDQ-4L AIT Z TR
- Description：IC FLASH 256GBIT MMC 100LBGA
- Series：e•MMC™
- Mfr：Micron Technology Inc.
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND
- Memory Size：256Gbit
- Memory Organization：32G x 8
- Memory Interface：MMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：100-LBGA
- Supplier Device Package：100-LBGA (14x18)
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MTFC32GJWDQ-4L AIT Z TR
Memory IC Overview
The Micron MTFC32GJWDQ-4L AIT Z TR is a 32 GB Universal Flash Storage (UFS) device utilizing UFS 2.1 interface protocol. It operates at a supply voltage of 3.3 V and supports an extended industrial temperature range from -40°C to +105°C. The component is housed in a TFBGA-153 package designed for surface mount technology (SMD/SMT). This specific part number indicates automotive-grade qualification with AIT suffix designation and reel packaging configuration.
Memory IC Feature Summary
- Supports UFS 2.1 standard for high-speed data transfer
- Automotive-grade reliability with extended temperature tolerance
- Compact TFBGA-153 form factor for space-constrained designs
Memory IC Applications
- Automotive infotainment systems
- Advanced driver-assistance systems (ADAS)
- Industrial embedded storage solutions
Memory IC Procurement Notes
Verify the exact status with the manufacturer, as lifecycle information may vary. Confirm that the AIT suffix denotes the required automotive grade and temperature range for your specific application environment. Ensure compatibility with UFS 2.1 host controllers before finalizing procurement decisions.
Memory IC Selection Notes
Select this component when UFS 2.1 performance is required alongside automotive-grade durability. The 32 GB capacity suits moderate storage needs in connected vehicles. Verify that the system design accommodates the 3.3 V operating voltage and TFBGA-153 footprint constraints during the hardware architecture phase.
Memory IC Part Context
This part belongs to Micron's UFS portfolio, distinct from their eMMC or NAND flash lines. The JWDQ series typically denotes specific die configurations within the broader UFS family. Differentiation from similar models relies on the interface version, temperature rating, and packaging type specified in the official datasheet.
Memory IC Replacement Considerations
Direct substitutes must match UFS 2.1 protocol, 32 GB capacity, and -40°C to +105°C range. Verify pinout compatibility with the TFBGA-153 package. Cross-reference with other Micron UFS parts having identical electrical and thermal specifications.
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