MTFC32GJWEF-4M AIT Z TR

Memory IC Overview

The MTFC32GJWEF-4M AIT Z TR is a 256 Gbit (32 GB) NAND flash memory component manufactured by Micron Technology. It operates within the eMMC standard and utilizes a 169-TFBGA package for surface mount installation. The device supports an extended industrial operating temperature range of -40°C to +85°C, ensuring reliability in demanding environments. This non-volatile memory solution integrates high-density storage with industry-standard interfaces for efficient data management.

Memory IC Feature Summary

• Supports eMMC interface standards for standardized connectivity
• Utilizes NAND flash technology for non-volatile data retention
• Designed for surface mount assembly on printed circuit boards

Memory IC Applications

• Industrial embedded systems requiring wide temperature tolerance
• Mobile devices utilizing eMMC storage architecture
• Consumer electronics needing compact high-density flash memory

Memory IC Procurement Notes

Verify the specific suffix and revision level against official Micron documentation to ensure compatibility with your design requirements. Confirm lead times and availability directly with authorized distributors or the manufacturer, as supply chain conditions may vary. Ensure that the procurement channel provides valid traceability and authenticity guarantees for this electronic component.

Memory IC Selection Notes

Select this component when a 32 GB capacity is required within a 169-ball TFBGA footprint. Consider the -40°C to +85°C operating range if the application involves industrial or harsh environmental conditions. Verify that the host controller supports the specific eMMC version compatible with this Micron part number before integration into the system design.

Memory IC Part Context

This part belongs to Micron's eMMC product line, designed for mobile and embedded applications. It offers a balance of performance and density using NAND technology. The 169-TFBGA package allows for space-constrained designs while maintaining robust electrical connections. It serves as a primary storage solution for various digital devices requiring reliable non-volatile memory.

Memory IC Replacement Considerations

Check for direct substitutes within the same Micron series that share identical pinouts and electrical characteristics. Ensure any replacement maintains the 169-TFBGA package and 32 GB capacity. Verify that the alternative part meets the same industrial temperature specifications and eMMC compliance standards.