ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
MTFC512GBGBCTD-AIT TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is UFS 4TBIT 153/196 TFBGA IT. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MTFC512GBGBCTD-AIT TR
- Description：UFS 4TBIT 153/196 TFBGA IT
- Series：-
- Mfr：Micron Technology Inc.
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MTFC512GBGBCTD-AIT TR
Memory IC Overview
The MTFC512GBGBCTD-AIT TR is a Universal Flash Storage (UFS) device manufactured by Micron Technology. It provides a storage capacity of 4 Tbit and utilizes TLC NAND configuration. The component is housed in a 153/196 TFBGA package with dimensions of 13 mm x 11 mm x 0.9 mm. It operates within an industrial temperature range from -25°C to +85°C and requires a supply voltage of 2.5 V.
Memory IC Feature Summary
- Supports the Universal Flash Storage protocol for high-speed data transfer
- Integrates TLC NAND flash memory technology
- Designed for surface-mount installation on printed circuit boards
Memory IC Applications
- Wireless devices
- Mobile computing platforms
- Industrial embedded systems
Memory IC Procurement Notes
Verify current lifecycle status directly with Micron Technology, as availability information may be incomplete or subject to change. Confirm that the specific suffix indicates reel packaging rather than tray distribution. Ensure compatibility with the target system's power requirements and thermal management capabilities before finalizing procurement decisions.
Memory IC Selection Notes
Select this component when a UFS interface is required for mobile or wireless applications. The industrial temperature rating makes it suitable for environments exceeding standard commercial limits. Verify that the host controller supports the specific UFS version associated with this part number to ensure proper communication and performance.
Memory IC Part Context
This part belongs to Micron's Universal Flash Storage portfolio, designed to replace legacy eMMC solutions in modern portable electronics. It offers higher bandwidth and command queuing capabilities compared to previous generations. The TFBGA form factor allows for compact integration into space-constrained mobile devices and IoT hardware.
Memory IC Replacement Considerations
Consult official Micron documentation for verified substitute part numbers. Cross-referencing with similar capacity UFS devices requires validation of pinout compatibility and electrical specifications.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
