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MTSW-110-24-G-S-070 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is CONN HEADER VERT 10POS 2.54MM. Review the specifications below when checking this part for your BOM.
The MTSW-110-24-G-S-070 is a variable height PCB header strip manufactured by Samtec Inc. It features a 0.100" (2.54 mm) pitch and contains 24 contacts arranged in a single row. The connector utilizes phosphor bronze terminals with gold plating over nickel, ensuring reliable electrical performance. Designed for through-hole termination, it offers a flexible stacking capability that allows for modified post heights and body positions in precise increments to accommodate varying board thicknesses.
Verify the exact part number against official Samtec documentation to ensure correct configuration. Confirm that the specified terminal length and orientation match the design requirements. Check RoHS compliance status if environmental regulations apply to the final assembly. Ensure compatibility with mating socket strips before procurement.
Select this component when a standard fixed-height header is insufficient for the target board stack-up. The variable height feature accommodates manufacturing tolerances or custom spacer requirements. Verify that the single-row configuration aligns with the available footprint on the printed circuit board layout.
This component belongs to the MTSW series, which serves as a variation of the classic TSW header strip family. The series is characterized by its ability to offer a wide range of overall pin lengths while maintaining the standard 0.100-inch pitch. It is designed for general-purpose board stacking applications where flexibility in height is critical.
Consult the official Samtec catalog for direct substitutes within the MTSW family. Verify that any alternative part maintains the same pitch, row count, and termination style. Ensure that the replacement part supports the required variable height specifications for the specific application.
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