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MTV1-30PL82 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists ITT Cannon, LLC. Its product description is MICRO. Review the specifications below when checking this part for your BOM.
The MTV1-30PL82 is a board-to-board and mezzanine connector header manufactured by ITT Cannon. It features a through-hole mounting type with 30 positions arranged in a single row. The connector utilizes a 1.27 mm (0.050 inch) pitch for the contacts. It is designed for solder termination and operates within a temperature range of -55°C to 125°C. The product status is listed as active.
Verify the specific ordering suffix and contact finish thickness requirements against the official ITT Cannon datasheet before procurement. Ensure that the through-hole solder termination method aligns with your manufacturing process capabilities. Confirm that the operating temperature range meets the environmental demands of your specific application scenario.
Select this component when a single-row, 30-position header with a 1.27 mm pitch is required. Consider the through-hole mounting style if surface-mount options are not suitable for the mechanical stability needs. Evaluate the push-pull fastening feature against the mating cycle requirements of the target system.
This part belongs to the ITT Cannon interconnect portfolio, which serves markets including commercial aviation, defense, industrial, and medical sectors. The manufacturer provides innovative solutions ranging from miniaturized products to ruggedized harsh environment connectors, ensuring compliance with global quality standards such as ISO 9001 and AS9100.
No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with mating receptacles using the 1.27 mm pitch specification.
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