MX30LF2G28AC-TI

Memory IC Overview

The MX30LF2G28AC-TI is a 2 Gbit Single-Level Cell (SLC) NAND flash memory device manufactured by Macronix. It features an x8 data bus width and operates within a voltage range of 2.7 V to 3.6 V. The component utilizes the ONFI 1.0 compliant parallel interface and supports a page size of 2K+112 bytes with a block size of 128K+7K bytes. It requires 8-bit ECC per 540 bytes and includes 30 pages of One-Time Programmable (OTP) memory. The device guarantees data retention for 10 years and endurance up to 100,000 program/erase cycles.

Memory IC Feature Summary

• Supports ONFI 1.0 standard parallel interface with compatible command sets
• Includes dedicated Block Protection Status Read command functionality
• Features unique ID support conforming to ONFI standards
• Provides internal weak pull-down on protection pin for simplified integration

Memory IC Applications

• Embedded storage systems requiring SLC NAND reliability
• Consumer electronics utilizing parallel NAND interfaces
• Industrial applications operating within -40°C to 85°C temperature ranges
• Firmware migration projects replacing older MX30LF2G28AB variants

Memory IC Procurement Notes

Verify that the specific ordering suffix matches the required package type, as the source material primarily references the MX30LF2G28AB family. Confirm firmware compatibility regarding spare area size differences if migrating from other generations. Ensure supply chain sources provide official datasheets to validate electrical parameters against current production revisions.

Memory IC Selection Notes

Select this component when an x8 parallel interface and 2 Gbit capacity are required. Consider the MX30LF2G18AC series if lower ECC overhead or smaller spare areas are preferred, noting the necessary firmware adjustments. Verify that the system design accommodates the specific power consumption profiles during active read and program operations.

Memory IC Part Context

This part belongs to the Macronix MX30LF series of SLC NAND flash memories. It shares architectural similarities with the MX30LF2G28AB, differing primarily in ECC requirements and spare area configuration. The device is designed for general-purpose non-volatile storage applications where moderate performance and high reliability are prioritized over high-density capacities.

Memory IC Replacement Considerations

The MX30LF2G18AC-TI serves as a direct functional replacement with identical pinouts. Migration requires firmware updates to handle the reduced spare area size and different ECC levels. The PT pin on the replacement device can be left floating if block protection is not utilized.