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MX7537KENG is listed in the Encoders, Decoders, Converters range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is CMOS PARALLEL LOADING DUAL 12 BI. Review the specifications below when checking this part for your BOM.
The MX7537KENG is a dual-channel, 12-bit multiplying digital-to-analog converter (DAC) manufactured by Analog Devices Inc. under the Maxim Integrated brand. It utilizes an R-2R resistor ladder architecture and features parallel data loading for interface connectivity. The component operates within an analog and digital supply voltage range of 10.8 V to 16.5 V. Designed for surface-mount applications, it is housed in a 24-pin PLCC package. The device supports an operating temperature range from -40°C to +85°C, ensuring functionality across extended industrial conditions.
Verify the specific suffix 'ENG' against official Analog Devices documentation to confirm pinout compatibility and electrical specifications. Ensure that the required operating temperature range aligns with the commercial or industrial grade variants available. Confirm RoHS compliance status and check for any active obsolescence notices prior to finalizing procurement plans.
Select this component when a dual-channel, high-resolution multiplying DAC is required for space-constrained designs. The PLCC package offers a suitable footprint for prototyping and production boards utilizing standard surface-mount assembly techniques. Consider the parallel interface requirements and ensure the system logic levels are compatible with the specified supply voltages.
The MX7537 series represents a family of high-performance multiplying DACs known for their accuracy and speed. The KENG variant specifically denotes the surface-mount PLCC packaging option within this lineup. This series is widely recognized in industrial automation and instrumentation for its reliable R-2R ladder performance and CMOS compatibility.
Direct replacements may include other parts from the MX7537 family with different package options, such as the MX7537LN+ for through-hole DIP or the MX7537JEWG+ for SOIC packages. Verify that substitute components maintain identical pin configurations and electrical characteristics to ensure seamless integration without circuit redesign.
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