MX852BB0030-TR

Overview

The MX852BB0030-TR is a ClockWorks FUSION family clock management IC integrating a quartz crystal, synthesizer, and fanout buffers in a single 38-pin 5 mm x 7 mm LGA package. It generates five differential HCSL outputs at 156.25 MHz with ±50 ppm total stability. The device operates from a 2.5V or 3.3V supply (2.375V to 3.465V) and draws up to 210 mA core current. Typical phase noise is 162 fs (12 kHz to 20 MHz integration range), with period jitter of 1.65 ps peak-to-peak (100 Hz to 40 MHz). Outputs include independent OE1 and OE2 controls for Bank 1 and Bank 2.

Feature Summary

• Integrates quartz crystal, PLL synthesizer, and five 156.25 MHz HCSL fanout buffers
• Typical RMS phase noise of 162 fs (12 kHz to 20 MHz) and 73 fs (1.875 MHz to 20 MHz)
• Dual output enable pins (OE1, OE2) control tri-state status for separate output banks
• ±50 ppm total frequency stability over the –40°C to +85°C operating temperature range

Applications

• 10/40/100 Gigabit Ethernet systems
• Fibre Channel 10G/12G SERDES interfaces

Procurement Notes

Verify the -TR suffix indicates a 1,000-unit tape and reel packaging format rather than the standard tube configuration. Confirm that the specific ordering suffix matches the required media type for production assembly. Ensure compatibility with the 38-lead LGA land pattern specifications provided in the datasheet.

Selection Notes

Select this component when a compact solution combining reference generation and distribution is required. The integrated design eliminates external crystal requirements and reduces board space. Verify that the 156.25 MHz frequency aligns with system timing needs and that the HCSL logic levels are compatible with downstream receiver inputs.

Part Context

This part belongs to the Microchip ClockWorks FUSION family, designed to consolidate clock chain functions into a single footprint. The MX852BB0030 variant specifically targets high-speed serial data applications requiring low jitter performance. The -TR suffix denotes the reel-based packaging option for automated surface-mount assembly.

Replacement Considerations

Consult official Microchip documentation for verified cross-reference part numbers. Do not substitute based on generic electrical parameters alone; verify pinout compatibility and thermal resistance characteristics.