MYC-LMX9352-8E1D-170-I

Microcontrollers, Microprocessor, FPGA Modules Overview

The MYC-LMX9352-8E1D-170-I is a System-On-Module (SoM) from MYIR Tech Limited, measuring 37mm by 39mm. It integrates the NXP i.MX9352 processor, featuring dual ARM Cortex-A55 cores at 1.7GHz and a Cortex-M33 co-processor at 250MHz. The module includes an Arm Ethos U-65 microNPU with 0.5 TOPS performance. Memory configurations consist of 1GB or 2GB LPDDR4 paired with 8GB eMMC flash and a 32KB EEPROM. Power management is handled by the PCA9451AHNY IC. The device supports industrial operating temperatures ranging from -40°C to 85°C and runs Linux 6.12 or Debian 12.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Dual-core ARM Cortex-A55 CPU running at 1.7GHz with a dedicated 250MHz Cortex-M33 real-time co-processor
• Integrated Arm Ethos U-65 microNPU providing up to 0.5 TOPS for machine learning inference
• 218-pin LGA expansion interface supporting MIPI-DSI, LVDS, RGB displays, and MIPI-CSI/Parallel camera inputs
• Connectivity includes dual Gigabit Ethernet with TSN support, two USB 2.0 ports, and dual CAN-FD interfaces

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial Human-Machine Interfaces (HMI)
• Electric Vehicle (EV) charging stations
• Motion control systems
• Healthcare equipment
• IoT edge gateways

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific memory configuration required, as the part number covers both 1GB and 2GB LPDDR4 variants. Confirm that the industrial temperature range (-40°C to 85°C) meets the deployment environment requirements. Ensure compatibility with the provided Linux 6.12 kernel source code and Yocto build tools for software integration.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a compact form factor is needed alongside heterogeneous computing capabilities. The inclusion of the Cortex-M33 core allows for decoupling real-time control tasks from the main application processor. Consider the available peripheral signals on the 218-pin interface against carrier board design constraints, noting that some signals may be reused.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This SoM belongs to the MYC-LMX9X family, designed around the NXP i.MX 93 series processors. It utilizes the Energy Flex architecture to optimize power efficiency for industrial and IoT applications. The module serves as a reference hardware platform for developers utilizing the MYD-LMX9X development board.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Alternative solutions would require evaluating other NXP i.MX 93-based modules or different processor families based on specific pinout and performance requirements.

Microcontrollers, Microprocessor, FPGA Modules FAQ

What operating systems does the MYC-LMX9352-8E1D-170-I support?

The module supports Linux 6.12 and Debian 12. MYIR provides complete software bundles including kernel and driver source codes.

Does the module include wireless connectivity?

The SOM itself does not list integrated Wi-Fi or Bluetooth. However, the compatible MYD-LMX9X development board supports optional USB-based WiFi modules and M.2 sockets for 4G/5G LTE modules.

What is the maximum display resolution supported?

The module supports a 4-lane MIPI-DSI interface capable of driving displays up to 1080p60, as well as 4-lane LVDS and parallel RGB interfaces.