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N13SP2R5M is listed in the Inrush Current Limiters (ICL) range at ChipApex. The manufacturer field lists YAGEO. Its product description is ICL 2.5 OHM 20% 6A 13MM. Review the specifications below when checking this part for your BOM.
The YAGEO N13SP2R5M is a Negative Temperature Coefficient (NTC) thermistor designed for inrush current limiting applications. It features a nominal resistance of 2.5 Ohms with a tolerance of ±20% at 25°C. The component supports a maximum steady-state current of 6 A and has a power rating of 3 W. Physically, it measures 13 mm in diameter with a radial lead spacing of 7.5 mm. It operates within a temperature range of -40°C to +200°C and utilizes PCB mount installation.
Verify the specific suffix designation when ordering, as variants such as N13SP2R5M-F may indicate different packaging or manufacturing status. Confirm that the selected part number matches the required electrical specifications for the target circuit design. Cross-reference official manufacturer documentation to ensure compliance with current production statuses and availability constraints before finalizing procurement plans.
Select this component based on its 2.5 Ohm initial resistance and 6 A current handling capability relative to the system's peak inrush requirements. Ensure the thermal environment allows for adequate heat dissipation given the 3 W power rating. Verify that the 13 mm body size and 7.5 mm lead pitch fit within the designated PCB footprint constraints without interfering with adjacent components.
This part belongs to the YAGEO SP series of NTC thermistors, which are specialized for inrush current limiting duties. The series offers various resistance and current ratings to suit different power levels. These components serve as critical passive elements in protecting downstream electronics from transient overcurrent conditions common in industrial and consumer power systems.
Direct substitutes include other NTC inrush limiters with matching 2.5 Ohm resistance and 6 A current ratings. Equivalent parts must maintain similar physical dimensions and lead spacing for board compatibility. Verify thermal performance curves to ensure comparable energy absorption capabilities during surge events.
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