N74F30N,602

Inverter Gates Overview

The N74F30N,602 is an 8-input NAND gate from the 74F logic family. It operates within a supply voltage range of 4.5V to 5.5V and supports a commercial temperature range of 0°C to +70°C. The device features a typical propagation delay of 3.2ns with a total supply current of 1.7mA. It utilizes a 14-pin plastic dual in-line package (DIP) configuration.

Inverter Gates Feature Summary

• Provides eight-input NAND logic functionality
• Supports high-speed signal processing with low propagation delay
• Features standard TTL-compatible input and output levels

Inverter Gates Applications

• Digital logic circuit design
• Data processing systems
• Microprocessor interface circuits

Inverter Gates Procurement Notes

Verify component authenticity through authorized distributors or official manufacturer channels. Confirm that the specific part number matches the required 14-pin DIP package and commercial temperature rating. Ensure compliance with RoHS directives if applicable to your manufacturing standards. Review the datasheet for absolute maximum ratings to prevent operational damage during integration.

Inverter Gates Selection Notes

Select this component when an 8-input NAND gate is required for high-speed digital applications. Consider the 74F series characteristics for faster switching speeds compared to standard logic families. Verify that the 14-pin DIP package aligns with your PCB layout and assembly requirements. Ensure the operating voltage and temperature ranges meet your system specifications.

Inverter Gates Part Context

This component belongs to the 74F logic family, known for its high-speed performance. It is manufactured by NXP USA Inc., formerly Philips Semiconductors. The 74F series is designed for applications requiring fast switching times and low power consumption relative to other high-speed logic families.

Inverter Gates Replacement Considerations

Check for equivalent parts such as the N74F30D variant which shares identical electrical characteristics but uses a different surface-mount package.