Memory IC NAND512R3A2CZA6E product image

NAND512R3A2CZA6E

  • Description:IC FLASH 512MBIT PAR 63VFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:3cad55cf2740 Category: Brand:

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NAND512R3A2CZA6E is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 512MBIT PAR 63VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NAND512R3A2CZA6E

  • Description:IC FLASH 512MBIT PAR 63VFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND
  • Memory Size:512Mbit
  • Memory Organization:64M x 8
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:50ns
  • Voltage - Supply:1.7V ~ 1.95V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:63-TFBGA
  • Supplier Device Package:63-VFBGA (9x11)
  • Access Time:50 ns

Memory IC datasheet and documents for NAND512R3A2CZA6E

NAND512R3A2CZA6E

Memory IC Overview

The NAND512R3A2CZA6E is a 512-Mbit Single Level Cell (SLC) NAND flash memory from the small page family. It features a 528-byte page size with 16 spare bytes for x8 bus width devices. The component operates on a 1.8 V supply voltage ranging from 1.7 to 1.95 V. It utilizes a multiplexed address/data interface and is housed in a VFBGA63 package measuring 9 x 11 mm with a 1.05 mm height.

Memory IC Feature Summary

  • Supports hardware data protection via a dedicated Write Protect pin that prevents program and erase operations during power transitions.
  • Includes a Copy Back program mode to optimize defective block management by allowing data transfer without external re-sending.
  • Features an open-drain Ready/Busy output enabling multiple memories to share a single pull-up resistor line.

Memory IC Applications

  • Mass storage applications requiring cost-effective solutions
  • Systems utilizing SLC NAND technology for high reliability
  • Embedded designs needing multiplexed address/data interfaces

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm package type, voltage range, and feature options such as Chip Enable 'don't care'. Ensure compatibility with system voltage requirements and interface protocols before integration.

Memory IC Selection Notes

Select this component for designs requiring 512 Mbit density with small page architecture. Confirm the need for 1.8 V operation versus 3 V variants. Evaluate if the VFBGA63 package dimensions fit the PCB layout constraints and thermal requirements of the target application.

Memory IC Part Context

This device belongs to the NAND512-A2C family, which includes densities up to 1 Gbit. It shares pinout compatibility within the family, facilitating migration between different memory densities without changing the footprint. The product is manufactured under the Numonyx brand, now part of Micron Technology.

Memory IC Replacement Considerations

Compatible replacements include other members of the NAND512-A2C family such as NAND512R3A2CV6E or NAND512W3A2C, provided they match the required voltage and package specifications.

NAND512R3A2CZA6ENAND512R3A2CZA6E

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